柔性铜-银复合薄膜的激光直写制备及其导热特性  

Thermal conductivity of flexible Cu-Ag composite thin films by laser direct writing

作　　者：姚煜 郭伟[2] 刘通[2] 周兴汶 YAO Yu;GUO Wei;LIU Tong;ZHOU Xingwen(Beijing Innowind Aerospace Equipment Company Limited,Beijing,100854,China;Beihang University,Beijing,100191,China;Soochow University,Suzhou,215000,China)

机构地区：[1]北京新风航天装备有限公司,北京100854 [2]北京航空航天大学,北京100191 [3]苏州大学,苏州215000

出　　处：《焊接学报》2023年第12期75-81,I0008,共8页Transactions of The China Welding Institution

基　　金：中国博士后科学基金(2023M732524);江苏省自然科学基金(BK20230497);江苏省卓越博士后计划(2023ZB548)。

摘　　要：随着柔性电子产品对高效热管理的需求不断增长,近年来制备高导电性柔性薄膜越来越受到人们的广泛关注.以聚酰亚胺(PI)为基底,采用激光直写技术制备铜(Cu)和铜-银(Cu-Ag)薄膜,并对制备的Cu-Ag薄膜进行了物相分析和结构表征.结果表明,铜纳米颗粒和银纳米线在激光辐照的作用下表面局部熔化,进而烧结;通过比较直写制备的铜薄膜和Cu-Ag薄膜在不同温度下7天内电阻的变化,得出银的引入提高了复合材料整体的抗氧化性;对Cu/PI和Cu-Ag/PI两种复合材料的热扩散系数和热导率进行测试,得出银的引入提高了复合薄膜的热导率,Cu-Ag/PI薄膜表现出比Cu/PI薄膜更好的热性能.为制备具有良好热稳定性的Cu/PI和Cu-Ag/PI复合材料提供了一种快速简便、经济节约的方法.With the increasing demand of flexible electronic products for efficient thermal management,the preparation of flexible thin films with high conductivity has attracted more and more attention in recent years.Cu and Cu-Ag thin films are prepared by laser direct writing technique on polyimide(PI)substrate.The phase analysis and structure characterization of the two films show that the copper nanoparticles and silver nanowires are sintered by partial melting of their surface under laser irradiation.By comparing the resistance changes of prepared copper and Cu-Ag thin films at different temperatures for 7 days,it is concluded that the introduced silver improves the overall oxidation resistance of the composites.The thermal diffusivity and thermal conductivity of the two composites are tested,and it is found that the thermal conductivity of Cu-Ag/PI is significantly improved,showing better thermal performance than Cu/PI.This work provides a quick,simple and economical method for the preparation of Cu/PI and Cu-Ag/PI composites with good thermal stability.

关 键 词：激光直写技术 Cu薄膜 Cu-Ag薄膜 热导率 

分 类 号：TG456[金属学及工艺—焊接]