碳化硅功率器件用有机硅灌封胶材料耐温性能研究  

Temperature resistance of organic silicone encapsulant used in silicone carbide power devices

作　　者：林荧 史玉龙 刘育豪 张云霄 张博雅 文韬 LIN Ying;SHI Yulong;LIU Yuhao;ZHANG Yunxiao;ZHANG Boya;WEN Tao(School of Electrical and Automation Engineering,Hefei University of Technology,Hefei 230009,China;College of Electrical Engineering and Automation,Fuzhou University,Fuzhou 350108,China;Xi′an Jiaotong University,Xi′an 710049,China)

机构地区：[1]合肥工业大学电气与自动化工程学院,安徽合肥230009 [2]福州大学电气工程与自动化学院,福建福州350108 [3]西安交通大学,陕西西安710049

出　　处：《绝缘材料》2023年第12期24-33,共10页Insulating Materials

摘　　要：碳化硅(SiC)功率器件高功率密度化的发展趋势和航空领域的应用需求,对封装用有机硅灌封胶材料的耐高低温性能提出更高的要求。本文以SEMICOSIL 915HT、Duraseal 1533、R-2188 3种型号商用有机硅灌封胶材料为研究对象,比较三者的耐温性能。结果表明:灌封胶材料热降解过程中甲基氧化阶段的反应与灌封胶材料热氧老化过程的前期反应相同。R-2188的灌封胶材料具有较高的甲基氧化反应活化能(249.5 kJ/mol)、335℃的起始热分解温度和在甲基氧化阶段较低的质量损失(5%),更适用于高温运行条件下SiC功率器件的封装。SEMICOSIL 915HT具有-81.1℃的结晶起始温度和0.006 4 min^(-1)的结晶速率,更适用于低温运行条件下SiC功率器件的封装。The high power density development and application demand in aerospace field of silicone carbide(SiC) power modules have proposed higher requirements for the high and low temperature resistance of organic silicone encapsulation materials used in modules packaging.In this paper,the temperature resistance of three silicone encapsulants(SEMICOSIL 915HT,Duraseal 1533,R-2188) was compared.The results show that the reaction in the methyl oxidation stage during the thermal degradation process is the same as the early reaction in the thermal oxygen ageing process of silicone encapsulants.The R-2188 encapsulant has 249.5 kJ/mol of highest activation energy for methyl oxidation reaction,335℃ of initial thermal decomposition temperature,and 5% of lower mass loss during the methyl oxidation stage,which is more suitable for the packaging of SiC power module under high-temperature operating conditions.The SEMICOSIL 915HT encapsulant has-81.1℃ of initial crystallization temperature and 0.006 4 min~(-1) of crystallization rate,which is more suitable for the packaging of SiC power module under low-temperature operating conditions.

关 键 词：有机硅灌封胶 碳化硅功率器件 封装 耐温性能 

分 类 号：TM215[一般工业技术—材料科学与工程]