磨料层动态平衡对蓝宝石衬底粗磨过程影响研究  

Research on the Influence of Dynamic Balance of Abrasive Layer on the Rough Grinding Process of Sapphire Substrate

作　　者：丁鹏[1] 李冰[1] DING Peng;LI Bing(Chongqing Optoelectronics Research Institute,Chongqing 400060,CHN)

机构地区：[1]重庆光电技术研究所,重庆400060

出　　处：《半导体光电》2023年第5期699-702,共4页Semiconductor Optoelectronics

摘　　要：在对蓝宝石衬底进行粗磨时,需采用大颗粒高硬度磨料以缩短用时。考虑到大颗粒磨料流动性和悬浮性弱的特征,通过监测去除量的指针的摆动情况研究粗磨过程中磨料颗粒的分布和运动规律,表明磨料层的动态平衡性对衬底的厚度均匀性和表面质量具有决定性影响,而该平衡的建立依赖于致密、均匀的初始磨料层,粗磨过程中补充的磨料仅能维持已有的平衡,不能在已失衡的情况下进行补救。该工作有助于提高粗磨工艺控制水平,并对深入研究研磨过程中磨料颗粒的运动情况具有一定的指导意义。When rough grinding the sapphire substrate,it is necessary to use abrasives with large particle and high hardness to shorten the time.Considering the weak flowability and suspension characteristics of large-particle abrasives,the distribution and motion patterns of abrasive particles during rough grinding were studied by monitoring the swing of the removal amount pointer.Research shows that the dynamic balance of the abrasive layer has a decisive impact on thickness uniformity and surface quality of the substrate,and the establishment of this balance depends on a dense and uniform initial abrasive layer.The supplementary abrasive during rough grinding could only maintain the existing balance and could not be remedied in an imbalanced situation.The work helps to improve the control level of rough grinding process and has certain enlightening significance for in-depth research on the movement of abrasive particles during the grinding process.

关 键 词：磨料层 动态平衡 蓝宝石衬底 粗磨 

分 类 号：TN305.2[电子电信—物理电子学]