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作 者:李晓艳 杨珊珊 何颖 王如文[2] LI Xiaoyan;YANG Shanshan;HE Ying;WANG Ruwen(Lanzhou Chemical Research Center of PetroChina Petrochemical Research Institute,Lanzhou Gansu 730060,China;PetroChina Lanzhou Lubricant Research and Development Center,Lanzhou Gansu 730060,China)
机构地区:[1]中国石油石油化工研究院兰州化工研究中心,甘肃兰州730060 [2]中国石油兰州润滑油研究开发中心,甘肃兰州730060
出 处:《石油化工应用》2023年第11期19-23,共5页Petrochemical Industry Application
摘 要:在5G通信领域,覆铜板(CCL)是加工印制电路板的基体材料。本文从非专利文献角度调研了聚丁二烯在覆铜板基体材料中的应用情况:目前碳氢树脂由于具有较低的介电常数和介电损耗,是基体材料的重要发展方向;液体聚丁二烯更是性能优异的碳氢树脂材料的代表,其作为热固性材料或光固化材料的组分应用于覆铜板。同时本文关注并分析了中国石化北京化工研究院和日本曹达的液体聚丁二烯专利技术,发现中国石化在该领域的专利较少且技术分散,仅在CN202011175471.8专利中明确叙述了液体聚丁二烯用于基材和铜箔的涂层,具有较高的剥离强度;曹达在该领域专利技术主要集中于阴离子聚合方法、官能团改性方法以及液体聚丁二烯的应用,例如用于光固化树脂、热固性树脂、黏结剂等。In the field of 5G communication,copper clad laminate(CCL)is the substrate material for processing printed circuit boards.In this paper,the application of polybutadiene in copper clad matrix materials is investigated from the perspective of non-patent literature.At present,hydrocarbon resin is an important development direction of matrix materials because of its low dielectric constant and dielectric loss.Liquid polybutadiene is a representative of hydrocarbon resin materials with excellent properties.It is used in CCL as a component of thermosetting material or photocuring material.At the same time,this paper focuses on and analyzes the patent technology of liquid polybutadiene of Beijing Research Institute of Chemical Industry and Nippon SODA.It is found that Beijing Research Institute of Chemical Industry has few patents in this field and the technology is scattered.Only in the patent CN202011175471.8,liquid polybutadiene is clearly described for the coating of substrate and copper foil,which has high peeling strength.Nippon SODA's patented technologies in this field mainly focus on anionic polymerization method,functional group modification method and the application of liquid polybutadiene,such as photocuring resin,thermosetting resin,binder,etc.
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