基于浸没式液冷技术的模块设计与实现  

Module Design and Realization Based on Immersion Liquid Cooling Technology

作　　者：付小月 刘俊[1] 王圣俊 何霜 FU Xiaoyue;LIU Jun;WANG Shengjun;HE Shuang(The 32nd Research Institute of CETC,Shanghai 201808,China)

机构地区：[1]中国电子科技集团公司第三十二研究所,上海201808

出　　处：《电子机械工程》2023年第6期38-41,共4页Electro-Mechanical Engineering

摘　　要：为满足目前自主可控的国产化芯片高性能、高可靠性的应用需求,文中设计并实现了一款基于浸没式液冷技术的加固型液冷模块。将所有元器件均浸没于模块的冷却液中,并通过合理的结构布局,强制冷却液流动,加速带走模块内各芯片产生的热量,有效解决了在有限空间内功率密度高、器件局部过热、能量利用率低等问题,提高了计算机整体的散热效率和空间利用率。最终浸没式液冷模块试制成功,注满冷却液,并满足项目各项指标要求,可为后续浸没式液冷技术在加固计算机领域的推广应用提供参考。In order to meet the high-performance and high-reliability application requirements of independent and controllable domestic chips,a reinforced liquid cooling module based on immersion liquid cooling technology is designed and realized.All components are immersed in the cooling liquid of the module,and through reasonable structural layout,theflow of cooling liquid is forced to accelerate the removal of heat generated by each chip in the module,which effectively solves the problems of high power density,local overheating of devices and low energy utilization rate in a limited space,and improves the overall cooling efficiency and space utilization rate of the computer.Finally,the liquid cooling module is successfully trial-produced,filled with cooling liquid and met the requirements of the project.It can provide a reference to promote the application of immersion cooling technology in thefield of reinforced computers in the future.

关 键 词：浸没式液冷技术 液冷模块 结构设计 

分 类 号：TK124[动力工程及工程热物理—工程热物理]