三维集成封装中光敏玻璃通孔制备工艺研究  

Study on the Preparation Process of Photosensitive Glass Through-Hole in Three-Dimensional Integrated Package

作　　者：王刚 叶刚 李奇哲 周超杰 夏晨辉 WANG Gang;YE Gang;LI Qizhe;ZHOU Chaojie;XIA Chenhui(The 58th Research Institute of China Electronics Technology Group Corporation,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,无锡214035

出　　处：《集成技术》2023年第6期93-102,共10页Journal of Integration Technology

摘　　要：玻璃通孔转接板是一种典型的垂直传输结构,广泛应用于三维集成封装电路。根据射频信号对小直径、窄节距垂直通孔的使用需求,该文基于光敏玻璃衬底,采用紫外光曝光、热处理以及湿法刻蚀方法,获得了深宽比为8∶1,最小直径为25.68μm的玻璃通孔。通过研究曝光量对光敏玻璃通孔制备工艺的影响,得到曝光过程中光敏玻璃的改性机理。实验结果表明,随着曝光量增加,通孔孔径增大;光敏玻璃改性过程是由表及里、由正面至背面的逐渐改性过程。这为玻璃通孔转接板的制备提供关键工艺支撑。Glass through-hole adapter plate is a typical vertical transmission structure widely used in threedimensional integrated package circuits.Based on the demand of radio frequency signals for the use of smalldiameter,narrow-pitch vertical vias,glass vias with a depth-to-width ratio of 8∶1 and a minimum diameter of 25.68μm were obtained based on a photosensitive glass substrate using ultraviolet exposure,heat treatment,and wet etching methods.The mechanism of modification of photosensitive glass during the exposure process was obtained by studying the effect of exposure amount on the through-hole preparation process of photosensitive glass through-hole preparation.The experimental results show that with the increase of exposure,the throughhole aperture increases,and the photosensitive glass modification process is a gradual modification process from the front to the back side from the surface to the inside.This provides key process support for the preparation of glass through-hole adapter plates.

关 键 词：玻璃通孔 三维集成 光敏玻璃 曝光 深宽比 

分 类 号：TN305.99[电子电信—物理电子学]