BGA封装电路焊球外观异常解决方案研究  

Research on Solution for Abnormal Appearances of Solder Balls in BGA Packaging Circuits

作　　者：丁鹏飞 王恒彬 王建超[1] DING Pengfei;WANG Hengbin;WANG Jianchao(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子与封装》2023年第12期9-13,共5页Electronics & Packaging

摘　　要：在使用常用测试插座进行BGA封装电路测试时,电路焊球外观会产生异常。为解决外观异常问题,以常用测试插座为基础,设计并实现了一种新型测试插座。常用测试插座为弹簧针式接触结构,新型测试插座的接触件采用无针式设计。通过实验验证在不同温度和工作电压下两种插座对BGA封装电路焊球外观的影响,并通过显微镜观察结果。结果表明,测试过程中优化设计后的插座能明显减少对BGA封装电路焊球外观的影响,同时,不同温度和工作电压对BGA封装电路焊球外观并无明显影响。Abnormal appearances of circuit solder balls may occur during BGA packaging circuit testing using commonly used test sockets.In order to solve the problem of abnormal appearance,a new type of test socket is designed and realized based on the commonly used test sockets.Commonly used test sockets have a spring-loaded needle-type contact structure,while the new test sockets adopt a needle-free design for the contact parts.The effects of two types of sockets on the appearances of solder balls in BGA packaging circuits at different temperatures and operating voltages are verified through experiments,and the results are observed through a microscope.The results show that the optimized design of the socket can significantly reduce the impact on the appearances of solder balls in the BGA packaging circuits during the test process,and at the same time,different temperatures and operating voltages do not have a significant impact on the appearances of solder balls in BGA packaging circuits.

关 键 词：测试插座 焊球外观 无针式设计 

分 类 号：TN305.94[电子电信—物理电子学]