集成电路成品测试的常见问题分析  

Analysis of Common Problems in Finished Integrated Circuit Testing

作　　者：倪宋斌 马美铭 NI Songbin;MA Meiming(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子与封装》2023年第12期20-23,共4页Electronics & Packaging

摘　　要：随着集成电路产业的快速发展,芯片特征尺寸不断缩小,其集成度与复杂度却越来越高,这使得集成电路测试的重要性不断上升。成品测试作为集成电路生产过程中的最后一步,其针对芯片电性能的测试也是最全面的。为了保证芯片在极端环境下仍可使用,一般在成品测试中会对芯片进行常温(25℃)、低温(-55℃)和高温(125℃)测试,其目的是剔除不良品。除了电性能不良造成的电路失效,还有因测试硬件老化或损坏、测试方法不当以及温度差异造成的假性失效。通过分析测试异常发生的原因,发现优化测试插座的选型和测试板的设计以及优化测试程序的设置可以减少测试异常,这些方法对提高测试准确性有一定帮助。With the rapid development of the integrated circuit industry,the chip feature size continues to shrink,and the integration and complexity are also increasing,which make the importance of integrated circuit testing continue to rise.As the last step in the production process of the integrated circuit,the finished product testing is also the most comprehensive for electrical performance of the chip.In order to ensure that the chip can still be used in extreme environments,the finished product testing is generally carried out at room temperature(25℃),low temperature(-55℃)and high temperature(125℃),which is aimed at eliminating defective products.In addition to circuit failures caused by poor electrical performance,there are also false failures caused by aging or damage of test hardware,improper test methods and temperature differences.By analyzing the causes of test anomalies,it is found that optimizing the selection of test sockets and the design of test boards as well as optimizing the setting of test programs can reduce test anomalies.These methods are helpful in improving test accuracy.

关 键 词：成品测试 测试设备 开短路测试 功能测试 

分 类 号：TN407[电子电信—微电子学与固体电子学]