基于随机振动过程应力分析的BGA焊点结构优化  

Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration

作　　者：杨雪霞[1] 孙勤润 王超 彭银飞 张伟伟 YANG Xue-xia;SUN Qin-run;WANG Chao;PENG Yin-fei;ZHANG Wei-wei(School of Applied Science,Taiyuan University of Science and Technology,Taiyuan,Shanxi 020024,China;Dongguan Institute of Technology,Dongguan University of Technology,Dongguan,Guangdong 523000,China)

机构地区：[1]太原科技大学应用科学学院,山西太原030024 [2]东莞理工学院机械工程学院,广东东莞523000

出　　处：《电子学报》2023年第10期2783-2790,共8页Acta Electronica Sinica

基　　金：国家自然科学基金(No.11602157);山西省自然科学基金面上项目(No.20210302123220);广东省普通高校机器人与智能装备重点实验室资助项目(No.2017KSYS009);东莞理工学院机器人与智能装备创新中心资助项目(No.KCYCXPT2017006)。

摘　　要：建立了板级BGA(Ball Grid Array)焊点有限元分析模型,选取芯片高度、焊点直径、焊点高度、焊点间距作为设计变量,以焊点应力作为响应目标,分别采用田口正交及曲面响应法设计了25组不同水平组合的焊点模型并进行仿真计算,通过数理统计分析及回归分析对焊点结构参数进行了优化,获得了焊点应力最小结构参数最优水平组合.结果表明:在相同条件下,曲面响应优化的结果优于田口正交的结果;应力最小的焊点水平组合为焊点直径0.32 mm,焊点高度0.20 mm,焊点间距0.36 mm;最优水平组合等效应力值为0.3915 MPa,降低了0.65 MPa,实现了BGA焊点结构参数的优化.A board-level BGA(Ball Grid Array)solder joint finite element model is established.The chip height,sol⁃der joint diameter,solder joint height,and solder joint spacing are selected as design variables,and the critical solder joint stress is used as the response target.We design 25 groups of solder joint models simulating and calculating based on the Ta⁃guchi orthogonal and the surface response method The structural parameters of the solder joints are optimized through math⁃ematical statistical and regression analysis.And the optimal solder structural combination with the minimum joint stress is obtained.The results show that the result of surface response optimization is better than the Taguchi orthogonal under the same conditions.And the best combination of solder joints is solder joint diameter 0.32 mm,solder joint height 0.20 mm,solder joint spacing 0.36 mm.The equivalent stress value of the best combination is 0.3915 MPa,which is reduced by 0.65 MPa.They show that the optimization of the structural parameters of BGA solder joints is achieved.

关 键 词：BGA焊点 田口正交 曲面响应 有限元 

分 类 号：TN4[电子电信—微电子学与固体电子学] TG404[金属学及工艺—焊接]