YBa_(2)Cu_(3)O_(7-δ)高温超导带材双面磁控溅射镀铜研究  

YBa_(2)Cu_(3)O_(7-δ)High-Temperature Superconducting Tape Prepared by Double Sid⁃ed Magnetron Sputtering with Copper Plating

作　　者：李小宝 古宏伟[2,3] 黄大兴 陈玉雷 杨坤 LI Xiaobao;GU Hongwei;HUANG Daxing;CHEN Yulei;YANG Kun(Eastern Superconducting Technology(Suzhou)Co.,Ltd.,Suzhou 215200,China;Institute of Electrical Engineering of the Chinese Academy of Sciences,Beijing 100081,China;University of Academy of Sciences School of Engineering Sciences,Beijing 100049,China)

机构地区：[1]东部超导科技(苏州)有限公司,江苏苏州215200 [2]中国科学院电工研究所,北京100081 [3]中国科学院大学工程科学学院,北京100049

出　　处：《铜业工程》2023年第6期31-37,共7页Copper Engineering

基　　金：国家自然科学基金项目(U2032217,52072366)资助。

摘　　要：采用磁控溅射方法在已经具备超导性能的单面镀银带上双面镀铜,然后进行电镀加厚。在液氮温区下采用四探针引线法对磁控溅射镀铜样品的临界电流进行测试,利用台阶仪对磁控溅射镀铜样品的膜厚进行测试分析,使用扫描电镜(SEM)分析磁控溅射镀铜样品和电镀铜样品的表面形貌,同时采用四探针引线法对复合镀样品、电镀样品、溅射镀样品的超导面常温表面电阻进行测试,最后采用弯曲法对电镀工艺和复合镀工艺制备的样品进行双面结合力测试。结果表明:进行双面溅射沉积会影响YBa_(2)Cu_(3)O_(7-δ)的临界电流,溅射镀铜样品的表面粗糙度小于电镀铜样品,以复合镀方式溅射不同厚度铜层时会影响表面电阻的变化,相同膜厚下溅射镀样品超导面的常温表面电阻约为传统电镀铜的13%,超导面的结合力较电镀法有所增强,但反面的结合力低于电镀法。综合比较而言,磁控溅射方法在YBa_(2)Cu_(3)O_(7-δ)带材应用方面会具有广阔的应用前景。Copper film was deposited both sides on a single-sided silver-plated YBa_(2)Cu_(3)O_(7-δ)high-temperature superconducting tape us‐ing the magnetron sputtering method.Subsequently,electroplating was used to thicken the copper layer.The critical current of copper plated magnetron sputtering samples was measured by four probe lead method in liquid nitrogen temperature region.The room tempera‐ture resistance of the superconducting surface on the composite plating sample and electroplating sampled and sputtering sampled was tested using the four-probe lead method.The surface morphology of magnetron sputtering copper plated and electroplated copper sam‐ples was analyzed by scanning electron microscopy(SEM).Samples at the same time by the method of four point probe lead composite plating,electroplating,sputtering plating samples of superconducting surface contact resistance were tested at room temperature.Final‐ly,the bending method was used to test the double-sided bonding force of the samples prepared by electroplating process and composite plating process.The results indicated that the critical current of YBa_(2)Cu_(3)O_(7-δ)could be affected by simultaneous double-sided sputtering deposition.The surface roughness of the sputtering plating copper sample was less than copper plating samples,when sputtering copper layers of different thickness in composite plating,the surface resistance changed.The contact resistance at room temperature of the su‐perconducting surface of the sputter-plated sample under the same film thickness was about 13%of that of the traditional electroplated copper.The binding force of superconducting surface was enhanced compared with electroplating method,but the adhesion strength of the opposite belowed plating method.This method in YBa_(2)Cu_(3)O_(7-δ)tape applications would have broad prospect of application.

关 键 词：高温超导 磁控溅射 铜膜 临界电流 

分 类 号：TB43[一般工业技术]