电子封装用Al-Si功能梯度材料的显微组织和性能  

Microstructure and properties of Al-Si functionally graded materials for electronic packaging

作　　者：周玮 王日初[1,2] 彭超群[1] 蔡志勇[1,2] Wei ZHOU;Ri-chu WANG;Chao-qun PENG;Zhi-yong CAI(School of Materials Science and Engineering,Central South University,Changsha 410083,China;Key Laboratory of Electronic Packaging and Advanced Functional Materials,Central South University,Changsha 410083,China)

机构地区：[1]中南大学材料科学与工程学院,长沙410083 [2]中南大学电子封装与先进功能材料重点实验室,长沙410083

出　　处：《Transactions of Nonferrous Metals Society of China》2023年第12期3583-3596,共14页中国有色金属学报（英文版）

基　　金：the financial support provided by the National Natural Science Foundation of China(No.52274369);the China Postdoctoral Science Foundation(No.2018M632986);the Natural Science Foundation of Hunan Province,China(No.2019JJ50766);the Postdoctoral Science Foundation of Central South University,China;the Science and Technology Program of Hunan,China(No.2020GK2044)。

摘　　要：通过喷雾沉积法制备用于电子封装的双层和三层Al-Si功能梯度材料。结果表明,梯度材料具有致密的显微组织和良好的层间结合。三层梯度材料的抗弯强度高于双层梯度材料,以高Si含量层为承载面的H-L方向的抗弯强度高于以低Si含量层为承载面的L-H方向。所有梯度材料的导热系数均超过140W/(m·K),且其热膨胀系数没有明显的差异。经热冲击处理后,双层梯度材料出现的裂纹比三层梯度材料更多更大,这是由于界面上的高热应力和大尺寸Si颗粒因应力集中而趋于破裂。Two-and three-layer Al−Si functionally graded materials(FGMs)for electronic packaging were prepared by spray deposition.The results show that dense microstructure and good interlayer bonding are obtained in the FGMs.The flexural strength of the three-layer FGMs is higher than that of the two-layer FGMs,and the flexural strength in the H-L direction with high Si content layer as the bearing surface is higher than that in the L-H direction with low Si content layer as the bearing surface.The thermal conductivity of all the FGMs exceeds 140 W/(m·K),and the coefficient of thermal expansion(CTE)shows no significant difference.After thermal shock treatment,more and larger cracks are found in the two-layer FGM than in the three-layer FGMs.This phenomenon is due to the high thermal stress at the interfaces and the tendency of large Si particles to rupture as a result of stress concentration.

关 键 词：电子封装 功能梯度材料 AL-SI合金 有限元分析 抗热震性能 

分 类 号：TN04[电子电信—物理电子学] TB34[一般工业技术—材料科学与工程]