基于FPGA的BGA产品自动测试系统  

Automation Test System for BGA Products Based on FPGA

作　　者：韩珂 王兴平 柳明辉 何渊 李健 HAN Ke;WANG Xingping;LIU Minghui;HE Yuan;LI Jian(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《电子工艺技术》2024年第1期31-34,共4页Electronics Process Technology

摘　　要：射频复合基板和标准射频BGA的集成方式在新一代射频电路集成设计中得到了广泛的应用。为应对BGA产品量大、种类多导致的测试难和效率低问题,研究了一套通用型的自动化测试系统,基于FPGA实现了对产品的供电、状态以及测试夹具中开关矩阵、直流电机的控制,使测试效率和稳定性大幅提升。The integration method of RF composite substrate and standard RF BGA has been widely applied in the new generation of RF circuit integration design.In order to deal with the problem of difficulty and low efficiency caused by the large quantity and variety of BGA products,an universal automation test system is studied.Based on FPGA,it realizes the control of power supply and state of the products,as well as the switch matrix and DC motor in the testfixture,which greatly improves the test efficiency and stability of the test results.

关 键 词：BGA FPGA 开关矩阵 直流电机 

分 类 号：TN606[电子电信—电路与系统]