自动检测设备高温下测试坐标修正方法  

Coordinate Correction Method for Automatic Test System under High Temperature

作　　者：左宁[1] 袁丽娟 胡奇威 霍鑫 ZUO Ning;YUAN Lijuan;HU Qiwei;HUO Xin(The 45th Research Institute of CETC,BeiJing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工艺技术》2024年第1期51-55,共5页Electronics Process Technology

摘　　要：硅晶圆半导体芯片在进行晶圆级电性能测量时,往往需要模拟芯片实际工作时的工作环境,如温度、湿度、气压。在自动探针台上进行高温环境模拟测试时,由于高温会导致测针、晶圆片和承片卡盘产生一定程度的形变,从而使得芯片上测试Pad位置坐标发生偏移,这种情况下,测试系统需要对形变后的测试点坐标进行修正。提出了一种基于机器视觉自动图形识别的在线修正测试点坐标偏移方法,用以解决自动探针台在高温环境下进行电性能测试时的测试坐标修正难题。When measuring the electrical performance of silicon wafer semiconductor chips at the wafer level,it is often necessary to simulate the actual working environment of the chip,such as temperature,humidity,air pressure.When conducting high-temperature environment simulation testing on an automatic probe platform,due to the high temperature,the measuring needle,wafer,and carrier chuck will undergo a certain degree of deformation,resulting in the displacement of the test pad position coordinates on the chip.In this case,the testing system needs to correct the deformed test point coordinates.An online correction method for testing point coordinate offset based on machine vision automatic pattern recognition is proposed to solve the problem of testing coordinate correction during electrical performance testing of automatic probe stations in high-temperature environments.

关 键 词：探针测试系统 坐标修正 高温形变 

分 类 号：TN406[电子电信—微电子学与固体电子学]