多能变换装备功率模块封装绝缘的“胶–固”沿面放电演化过程研究  

Research on the Evolution Process of “Gel-solid” Creeping Discharge ofPower Module Package Insulation of Multi-energy Conversion Equipment

作　　者：王健 闫豪生 陈晨 王伟[1] 李志辉 邹亮[2] 张黎[2] 李庆民 WANG Jian;YAN Haosheng;CHEN Chen;WANG Wei;LI Zhihui;ZOU Liang;ZHANG Li;LI Qingmin(State Key Lab of Alternate Electrical Power System with Renewable Energy Sources(North China Electric Power University),Changping District,Beijing 102206,China;School of Electrical Engineering,Shandong University,Jinan 250061,Shandong Province,China)

机构地区：[1]新能源电力系统国家重点实验室(华北电力大学),北京市昌平区102206 [2]山东大学电气工程学院,山东省济南市250061

出　　处：《中国电机工程学报》2023年第24期9447-9460,共14页Proceedings of the CSEE

基　　金：国家重点研发计划项目(2021YFB2601404)。

摘　　要：多能变换装备功率模块易在有机硅凝胶和陶瓷基板界面形成沿面放电。该文对高频电应力下胶–固绝缘放电特性、气泡流注发展过程和陶瓷基板损伤特性进行研究,并基于有机硅凝胶的固–液两相性和自愈性,将沿面放电问题转化为气泡发展问题,探究胶–固绝缘失效规律和损伤机理。研究表明:胶–固沿面放电脉冲信号集中于电压极性反转后和峰值附近,放电次数和幅值随频率的升高先增加后减少,随温度的升高单调递增;通过不同脱气方式,揭示了硅凝胶内部气泡和基板烧结气隙是影响沿面放电的重要因素;基板损伤与胶–固界面流注特性有关,并对沿面放电发展具有显著影响。研究结果可为IGBT封装绝缘结构设计提供一定参考。The power modules of multi-energy conversion equipment are prone to form creeping discharges at the interface of silicone gel and ceramic substrate.In this paper,the discharge characteristics of gel-solid insulation under highfrequency electrical stress,the development process of bubble injection and the damage characteristics of ceramic substrate are investigated.Based on the solid-liquid duality and self-healing of silicone gel,the problem of creeping discharge is transformed into a bubble development problem,and the failure law and damage mechanism of gel-solid insulation are explored.The study shows that the pulse signal of gel-solid creeping discharge is concentrated after the reversal of voltage polarity and near the peak,and the number and amplitude of discharge increase first and then decrease with the increase of frequency and increase monotonically with the increase of temperature.The different degassing methods reveal that the bubbles inside the silicone gel and the sintered air gap of the substrate are important factors affecting the creeping discharge.The damage of the substrate is related to the flow injection characteristics of the gel-solid interface and has a significant influence on the development of creeping discharge.The results can provide some reference for the design of IGBT package insulation structure.

关 键 词：陶瓷基板 有机硅凝胶 胶–固沿面放电 气泡 固–液两相性 损伤特性 

分 类 号：TM433[电气工程—电器]