电子元器件金铝键合失效分析研究  

Analysis of Gold-Aluminum Bonding Failure of Electronic Components

作　　者：高若源 裴选[1,2] 席善斌 王伟[1,2] 高东阳 彭浩[1,2] 黄杰 GAO Ruoyuan;PEI Xuan;XI Shanbin;WANG Wei;GAO Dongyang;PENG Hao;HUANG Jie(The 13th Research Institute of CETC,Shijiazhuang 050051,China;National Semiconducter Device Quality Supervision and Inspection Center,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051 [2]国家半导体器件质量检验检测中心,河北石家庄050051

出　　处：《电子产品可靠性与环境试验》2023年第6期74-78,共5页Electronic Product Reliability and Environmental Testing

摘　　要：金铝键合失效是电子元器件常见的失效模式之一。对某型号射频芯片和检波器两例产品开展了失效分析研究。结果表明,一例失效产品出现了键合丝脱落的情况,一例失效产品出现了键合拉力几乎为零的情况,这是由于铝焊盘与金键合丝之间形成了金铝间化合物,金铝间化合物电阻率较高,使得键合强度降低或键合脱开,最终导致产品失效。研究了金铝化合物的失效机理,借助扫描电子显微镜对金铝化合物形貌及元素进行了分析,最后对金铝化合物所导致的失效提出了预防和改进措施,对于提高电子元器件的可靠性具有一定的借鉴意义。Gold-aluminum bonding failure is one of the common failure modes of electronic components.A failure anaiysis of a RF chip and detector is carried out.The results show that the bonding wire fall off in one case of the failed product,and the bonding tension is almost zero in the other.This is due to the formation of Au-Al compounds between the aluminum pad and the gold bonding wires.The high resistivity of the Au-Al compound leads to the reduction of the bonding strength or the bond detaching,which ultimately leads to the failure of the product.The failure mechanism of Au-Al compound is studied,and the morphology and elements of Au-Al compound are analyzed by means of scanning electron microscope.Finally,the prevention and improvement measures for the failure caused by Au-Al compound are proposed,which has certain reference significance for improving the reliability of electronic components.

关 键 词：金铝键合 金铝化合物 失效分析 可靠性 柯肯德尔 

分 类 号：O614[理学—无机化学]