MEMS加速度计全温性能优化方法  被引量:1

MEMS accelerometer full-temperature performance optimization method

在线阅读下载全文

作  者:刘国文 刘宇[2] 李兆涵[2] 王学锋 金仲和[1] 王巍[3] LIU Guowen;LIU Yu;LI Zhaohan;WANG Xuefeng;JIN Zhonghe;WANG Wei(School of Aeronautics and Astronautics,Zhejiang University,Hangzhou 310027,China;Beijing Institute of Aerospace Control Device,Beijing 100039,China;China Aerospace Science and Technology Corporation,Beijing 100048,China)

机构地区:[1]浙江大学航空航天学院,杭州310027 [2]北京航天控制仪器研究所,北京100039 [3]中国航天科技集团有限公司,北京100048

出  处:《中国惯性技术学报》2024年第1期64-70,共7页Journal of Chinese Inertial Technology

基  金:装备预先研究共用技术项目(50917020302)。

摘  要:针对微机电系统(MEMS)加速度计全温性能低的问题,提出锚区应力对消方法、低应力粘接工艺和温度补偿方法。首先,通过调整两个键合的锚区面积大小实现锚区应力对消,使得加速度计的温度性能得到改善;然后,建立加速度计堆叠封装模型并对专用集成电路(ASIC)粘接参数、加速度计敏感结构点胶方式与点胶参数进行仿真分析,从而确定了加速度计的低应力粘接形式和粘接工艺;最后,对加速度计零偏和标度因数设计了三阶温度补偿方法并进行了实验测试。实验结果表明,加速度计全温零偏稳定性达到47.3μg(1σ)、全温标度因数稳定性达到43.6 ppm(1σ),提高了加速度计的全温性能。To improve the full-temperature performance of the micro-electro-mechanical system(MEMS)accelerometer,the stress cancellation of the anchor zone,low stress bonding technology and temperature compensation method are proposed.Firstly,the stress cancellation in the anchor zone is realized by adjusting the size of the anchor area of the two bonds,and the temperature performance of the accelerometer is improved.Then,the accelerometer stacking packaging model is established and the bonding parameters of application specific integrated circuit(ASIC),the dispensing methods and the dispensing parameters of accelerometer sensitive structure are simulated,so as to determine the low-stress bonding form and bonding process of the accelerometer.Finally,a three-order temperature compensation method is designed to compensate for zero bias and scale factor of accelerometer and tested experimentally.The experimental results show that the accelerometer zero bias stability over temperature reached 47.3μg(1σ)and scale factor stability over temperature reached 43.6 ppm(1σ),which improves the full-temperature performance of the accelerometer.

关 键 词:MEMS加速度计 应力对消 低应力粘接 温度补偿 

分 类 号:TP212.1[自动化与计算机技术—检测技术与自动化装置]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象