LED显示芯片行业现状与发展研究  

LED display chip industry status and development research

作　　者：卢文胜 LU Wen-sheng(Fujian Electronics&Information(Group)Co.,Ltd.)

机构地区：[1]福建省电子信息(集团)有限责任公司

出　　处：《中国集成电路》2023年第12期30-35,共6页China lntegrated Circuit

摘　　要：显示作为发光二极管(LED)重要的应用领域,其发展对LED产业具有巨大的影响。本文从LED衬底、外延、封装、转移技术等层面探讨技术演化路径,探索未来发展方向。另外,从产业链的角度来分析LED显示市场的竞争格局,探索在微型发光二极管(Micro LED)新技术的驱动下芯片企业、面板企业、终端企业的合作关系。据相关机构预测,Micro LED显示市场未来可期,企业掌握核心技术、强强联合、资源互补,才能保证在新一轮的应用中脱颖而出,全产业链共同发力,降本增效才能快速打开市场。Display as an important application field of LED,its development has a huge impact on the LED industry.This paper discusses the technology evolution path and explores the future development direction from the level of LED substrate,epitaxy,encapsulation and transfer technology.In addition,it analyzes the competitive pattern of LED display market from the perspective of industry chain,and explores the cooperative relationship among chip enter-prises,panel enterprises and terminal enterprises driven by the new technology of Micro LED.According to relevant organizations,Micro LED display market is predicted to be promising in the future,enterprises master the core tech-nology,strong combination of complementary resources in order to ensure that the new round of applications to stand out,the whole industry chain to work together to reduce costs and increase efficiency in order to quickly open the market.

关 键 词：Micro LED 衬底 外延 封装 转移技术 

分 类 号：TN312.8[电子电信—物理电子学]