集成电路制造工艺的质量管理分析  

Analysis of Quality Management in Integrated Circuit Manufacturing Processes

作　　者：贺京峰 HE Jingfeng(Guizhou Zhenhua Fengguang Semiconductor Co.,Ltd.,Guizhou 550018,China.)

机构地区：[1]贵州振华风光半导体股份有限公司,贵州550018

出　　处：《集成电路应用》2023年第11期28-29,共2页Application of IC

摘　　要：阐述集成电路制造中的工艺状况,探讨集成电路制造工艺的质量管理的优化策略,包括晶圆表面的缺陷和杂质的清洗工艺,制程参数的稳定和优化、制程控制系统的统计过程控制、设备的精度和稳定性控制。This paper describes the process status in integrated circuit manufacturing,explores optimization strategies for quality management in integrated circuit manufacturing processes,including cleaning processes for defects and impurities on wafer surfaces,stabilizing and optimizing process parameters,statistical process control of process control systems,and precision and stability control of equipment.

关 键 词：集成电路制造 制造工艺 制程优化 SPC 

分 类 号：TN405[电子电信—微电子学与固体电子学]