染色与渗透试验在BGA焊点质量分析中的应用  

Application of dye and pull test in BGA solder joint quality analysis

作　　者：高蕊 刘立国[1] 董丽玲[1] 张永华[1] GAO Rui;LIU Liguo;DONG Liling;ZHANG Yonghua(Wuxi Jiangnan Institute of Computing Technology,Wuxi 214083,Jiangsu,China)

机构地区：[1]无锡江南计算技术研究所,江苏无锡214083

出　　处：《印制电路信息》2024年第2期32-37,共6页Printed Circuit Information

摘　　要：在高密度组装焊点的质量评价中,染色与渗透试验不仅简单高效、易于操作,且反馈信息最为全面。基于标准测试方法,阐述了染色与渗透试验的基本原理及操作方法,并基于失效模式典型案例分析的方式,系统研究了染色与渗透试验中球栅阵列封装(BGA)焊点常见质量缺陷的具体表现形式及其产生机理,以期为可靠性分析工程师在实际测试中提供技术参考。In the quality evaluation of high-density assembly solder joints,dye and pull test is not only simple,efficient and easy to operate,but also has the most comprehensive feedback information.Based on the standard test methods,this paper expounds the basic principle and operation method of dye and pull test.Based on the typical case analysis of failure mode,this paper systematically studies the specific forms of common quality defects in ball grid array(BGA) solder joints and their mechanism in dye and pull tests,so as to provide technical reference for reliability analysis engineers in actual tests.

关 键 词：染色与渗透试验 球栅阵列封装(BGA)焊接质量 焊点开裂 

分 类 号：TN41[电子电信—微电子学与固体电子学]