微电子键合用复合微球制备技术与性能研究进展  

Research progress on preparation technology and properties of composite microspheres for microelectronic bonding

作　　者：张宁[1] 王秀峰[1] ZHANG Ning;WANG Xiufeng(School of Materials Science and Engineering,Shaanxi University of Science and Technology,Xian710021,China)

机构地区：[1]陕西科技大学材料科学与工程学院,陕西西安710021

出　　处：《电子元件与材料》2023年第11期1289-1301,共13页Electronic Components And Materials

摘　　要：多层多元复合微球具有硬度高、导电导热性好、可靠性高等优异性能,是解决三维高密度微电子产品在长期服役条件下互连可靠性问题的一类关键电子材料,其制备技术主要包括合金偏析(气体雾化技术、均匀液滴喷射技术、落管技术)和化学电镀。复合微球通常为多层多元核壳结构,核的主要成分为Cu、Al等高硬度、高熔点金属,用于提高微球稳定性;壳可为多层,主要成分为Sn、Sn-Ag、Sn-In、Sn-Bi、Sn-Ag-Cu等锡基合金,起键合作用。详细介绍了近年来微电子封装领域键合用核壳结构复合微球制备技术与性能研究进展,分析了复合微球应用中出现的问题,展望了复合微球制备技术的发展前景。Multilayer multi-component composite microspheres,with high hardness,good electrical and thermal conductivity,high reliability and other excellent performance,are critical electronic materials that determines the interconnection reliability of three-dimensional high-density microelectronic products under long-term service conditions.Its preparation technology mainly includes alloy segregation(Gas Atomization Technology,Uniform Droplet Spray,and Drop Tube Technology)and chemical plating.Composite microspheres are usually multilayer multi-component core-shell structure.The main constituents of the core are high hardness and high melting point metals such as Cu and Al to improve the stability of the microspheres.The shell is multi-layered with possible constituents such as Sn,Sn-Ag,Sn-In,Sn-Bi,Sn-Ag-Cu and other tin-based alloys,which are used for bonding.Here the recent research progress are reviewed on the preparation technology and performance of composite microspheres with core-shell structure for bonding in the field of microelectronic packaging.The problems are analyzed for using the composite microspheres,and the development of the composite microsphere preparation technology are prospected.

关 键 词：微电子键合 复合微球 综述 焊锡球 微电子封装 

分 类 号：TN605[电子电信—电路与系统]