有机封装基板常见失效模式与制程控制  

Common Failure Modes and Process Control of Organic Package Substrates

作　　者：周帅林 孟凡义 张领 李国有 滕少磊 ZHOU Shuailin;MENG Fanyi;ZHANG Ling;LI Guoyou;TENG Shaolei(Qinghe Electronic and Technology(Shandong)Co.,Ltd.,Ji′nan 250000,China)

机构地区：[1]清河电子科技(山东)有限责任公司,济南250000

出　　处：《电子与封装》2024年第2期62-71,共10页Electronics & Packaging

摘　　要：随着封装技术的迅速发展,集成电路封装需要具备微型化、多功能化、高频、高速、高性能以及低成本等特点。为了满足先进封装的需求,有机封装基板朝着小孔径、高布线密度、小尺寸等方向发展,这一发展趋势对基板的机械稳固性、散热性和电学性能提出了更高的要求,对内部互连可靠性、离子迁移以及焊点牢固性的控制带来很大挑战。研究了孔底开裂、离子迁移、焊点开裂等失效模式,分析其失效机理,总结失效模式的影响因素,有针对性地提出了有效的基板制程控制措施。With the rapid development of packaging technology,integrated circuit packaging needs to have characteristics such as miniaturization,multi-functionality,high frequency,high speed,high performance and low cost.In order to meet the needs of advanced packaging,organic package substrates are developing towards smaller aperture,high wiring density and smaller size.This development trend puts forward higher requirements on mechanical stability,heat dissipation and electrical performance of substrates,bringing great challenges to the control of the reliability of internal interconnections,ion migration and firmness of solder joints.Failure modes such as hole bottom cracking,ion migration and solder joint cracking are studied,their failure mechanisms are analyzed,influencing factors of failure modes are summarized,and effective control measures for substrate manufacturing process are proposed in a targeted manner.

关 键 词：孔底开裂 离子迁移 焊点开裂 失效模式 制程控制 

分 类 号：TN305.94[电子电信—物理电子学]