Y^(3+)掺杂二氧化硅磨料的合成及其在氧化锆陶瓷中的化学机械抛光行为  

Preparation of Y^(3+)-doped silica abrasives and the chemical mechanical polishing behavior of zirconia ceramics

作　　者：代三威 雷红 付继芳 DAI Sanwei;LEI Hong;FU Jifang(School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China;College of Sciences,Shanghai University,Shanghai 200444,China)

机构地区：[1]上海大学材料科学与工程学院,上海200444 [2]上海大学理学院,上海200444

出　　处：《上海大学学报（自然科学版）》2024年第1期31-42,共12页Journal of Shanghai University:Natural Science Edition

基　　金：国家自然科学基金资助项目(51975343)。

摘　　要：为了提高氧化锆陶瓷的抛光效率,在二氧化硅表面掺杂Y^(3+)得到改性磨料.X射线光电子能谱(X-ray photoelectron spectroscopy,XPS)分析表明,Y元素以Y(OH)_(3)的形式存在于改性磨料中.扫描电子显微镜(scanning electron microscope,SEM)和粒度分析结果表明,复合磨料呈球形,粒度均匀,无聚集体和2次颗粒出现.与纯胶体二氧化硅磨料相比,材料去除率(material removal rate,MRR)提高了33%左右.MRR增大的原因是掺杂的Y(OH)_(3)改变了二氧化硅颗粒的Zeta电位,减小了二氧化硅颗粒与氧化锆陶瓷之间的排斥力,增大了二氧化硅颗粒和氧化锆陶瓷基体之间的接触概率,导致摩擦系数增大.To improwe the polishing eliciency of zirconia ceramics,Y^(3+)wes doped on the surface of silica to obtain modified abrasives.X-ray photoelectron spectroscopy(XPS)enalysis showed that the Y element exists in the modified abrasive in the forn of Y(OH)_(3).Results of scanning electron microscopy(SEM)and particle size analysis showed that the cornposite abrasives were spherical with a uniform particle size,and no aggregation and secondary particles appeared.Compared with the pure colloidal silica abrasive,the material removal rate(MRR)of the composite abrasives was increased by approximately 33%.It also changes the zets potential of the silica particles and reduces the repulsion between the silica and zireonis ceramic surfece.This increases the contact probebility between the silica and zirconia ceramic wafer,resulting in an incresse in the coefficient ofriction.

关 键 词：氧化锆陶瓷 化学机械抛光 磨料 掺杂二氧化硅 Derjaguin-Landau-Verwey-Overbeek理论 

分 类 号：TG739[金属学及工艺—刀具与模具]