晶圆直接键合预处理关键技术研究进展  

Review of Key Technologies for Direct Wafer Bonding Pretreatment

作　　者：吴硕 徐康 洪孟 吕麒鹏 蒲茜 戴家赟 吴超群[1] 郭敏 WU Shuo;XU Kang;HONG Meng;LV Qipeng;PU Qian;DAI Jiayun;WU Chaoqun;GUO Min(School of Mechanical and Electrical Engineering,Wuhan University of Technology,Wuhan,430070,CHN;The Second Research Institute of China Electronics Technology Corporation,Taiyuan,030024,CHN;School of Mechanical and Electronic control engineering,Beijing Jiaotong University,Beijing,100044,CHN;Nanjing Electronic Devices Institute,Nanjing,210016,CHN)

机构地区：[1]武汉理工大学机电工程学院,武汉430070 [2]中国电子科技集团公司第二研究所,太原030024 [3]北京交通大学机械与电子控制工程学院,北京100044 [4]南京电子器件研究所,南京210016

出　　处：《固体电子学研究与进展》2023年第6期533-542,共10页Research & Progress of SSE

基　　金：国家重点研发计划项目(2022YFB3404300);湖北省自然科学基金资助项目(2021CFB306)。

摘　　要：晶圆键合技术已经广泛应用于功率型半导体光电器件、电子电力器件、大功率固体激光器、MEMS及光电集成等领域。晶圆键合技术根据有无通过中间层实现键合分为两大类,其中晶圆直接键合技术属于无中间层键合,该技术的关键点在于对晶圆预处理工艺的选择。本文就湿法和干法两方向对不同的晶圆直接键合预处理技术的特点进行了归纳总结,主要内容包括溶液清洗、蒸汽清洗、快速原子束轰击、等离子体表面活化以及紫外光活化的技术原理与要点。此外,还对晶圆直接键合预处理技术未来的创新与改善进行了展望。Wafer bonding technology has been widely applied in power semiconductor optoelectronic devices,electronic power devices,high-power solid-state lasers,MEMS,and optical integration fields.Wafer bonding technology can be divided into two major categories based on whether the bonding is achieved through an intermediate layer.Among them,direct wafer bonding technology belongs to the category of bonded without an intermediate layer.The key aspect of this technology lies in the selection of the wafer pretreatment process.This article summarizes the characteristics of different direct wafer bonding pretreatment technologies in the wet and dry directions,including the technical principles and key points of solution cleaning,steam cleaning,rapid atom beam bombing,plasma surface activation,and ultraviolet light activation.Furthermore,the future innovation and improvement of direct wafer bonding pretreatment technology are discussed.

关 键 词：先进封装制造技术 直接键合 表面预处理 蒸汽清洗 紫外光活化 

分 类 号：TN305.2[电子电信—物理电子学]