钎料合金蠕变行为及非耦合型本构理论研究进展  

Advances of Creep Behavior and Uncouple Constitutive Theory of Solder Alloy

作　　者：邢睿思 王龙[1] 侯传涛[1] XING Ruisi;WANG Long;HOU Chuantao(Science and Technology on Reliability and Environmental Engineering Laboratory,Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)

机构地区：[1]北京强度环境研究所可靠性与环境工程技术重点实验室,北京100076

出　　处：《强度与环境》2024年第1期13-22,共10页Structure & Environment Engineering

基　　金：国家自然科学基金(12002056);重点实验室基金(WDZC20220201)。

摘　　要：在严苛的服役环境与小型化结构设计需求的双重作用下,航天仪器设备所承受的载荷不断增加并愈加复杂,而焊点、引线等封装结构作为仪器设备的薄弱环节,一旦破坏往往会导致器件甚至设备功能丧失,为了提升仪器设备的环境适应性与可靠性,需要准确把握封装结构材料蠕变行为与损伤机理,完善钎料合金本构理论并提升材料蠕变性能预测精度,发展封装结构精细化仿真分析方法。本文梳理了钎料合金蠕变性能及其影响因素,回顾了非耦合型本构理论的发展历程与研究热点,分析了相关模型的预测能力,为深入理解钎料合金蠕变行为与性能预测奠定基础。As the miniaturization design of aerospace instruments,the instruments service in a tough environment with more and more complex loading.Solder joints,lead and other package structure is the weak link and the consequence of its failure is very serious,which may cause device damages.In order to improve the environmental adaptability and reliability of the package structures,the materials properties of solder alloy and the constitutive model should be investigated.In this paper,the investigation status of creep properties and uncouple constitutive model in recent years were reviewed comprehensively.Prediction capabilities of different constitutive models were discussed in details,which was beneficial for understanding of creep behavior of solder alloy.

关 键 词：钎料合金 蠕变性能 本构模型 焊点可靠性 

分 类 号：V216.45[航空宇航科学与技术—航空宇航推进理论与工程] TG425[金属学及工艺—焊接]