高纯溅射靶材回收研究现状  

Research status of recovery of high-purity sputtering targets

作　　者：仝连海 钟伟攀 李凤连 TONG Lianhai;ZHONG Weipan;LI Fenglian(Tongchuang Purun Advanced Materials Co.Ltd,Shanghai 201306,China;Tongchuang Purun(Shanghai)Electromechanical High-tech Co.Ltd,Shanghai 201400,China;Konfoong Materials(Shanghai)Co.Ltd,Shanghai 201306,China)

机构地区：[1]上海同创普润新材料有限公司,上海201306 [2]同创普润(上海)机电高科技有限公司,上海201400 [3]上海江丰电子材料有限公司,上海201306

出　　处：《中国有色冶金》2024年第1期61-67,共7页China Nonferrous Metallurgy

摘　　要：高纯溅射靶材在晶圆代工企业和液晶面板企业作为耗材使用。高纯溅射靶材利用率低,一般平面靶利用率低于30%,旋转靶难超过70%,回收溅射后的残靶具有非常高的经济价值和环保意义。本文综述了贵金属、ITO、钛、钽、铝、铜等高纯靶材的回收研究现状,总结了靶材回收过程中面临的共同问题。目前在高纯靶材的残靶回收中还存在金属回收率低、回收的纯度不高、工艺流程长等问题需要攻克和改善,作者展望了开发较短的流程、环境友好的工艺、探索高价值的用途,是未来高纯残靶回收技术改进和发展的方向。High purity sputtering targets are used as consumables in wafer foundries and LCD panel companies. The utilization rate of high purity sputtering target is low. The utilization rate of general flat targets is less than 30%, and it is difficult for rotating targets to exceed 70%. It is of great economic value and environmental significance to recycle the sputtered residual target. The research status of recovery of high purity target materials such as precious metals, ITO, titanium, tantalum, aluminum and copper were reviewed, and common problems in the recovery process of target materials were summarized. At present, there are still problems that need to be overcome and improved in the residual target recovery of high-purity target materials, such as low metal recovery rate, low purity of recovery, and long process flow, so the author anticipates that developing shorter process, environment-friendly process and exploring high-value uses are the directions for the improvement and development of high-purity residual target recycling and reuse technology in the future.

关 键 词：溅射靶材 残靶回收 贵金属 氧化铟锡 高纯金属 芯片 显示器 集成电路 

分 类 号：TF8[冶金工程—有色金属冶金] X758[环境科学与工程—环境工程]