塑封基板类器件翻新件无损鉴别方法研究  

Research on Nondestructive Identification Methods for the Refurbished Parts of Plastic Packaging Substrate Devices

作　　者：江徽 郭劼 虞勇坚[1] 张伟[1] 王倩倩 JIANG Hui;GUO Jie;YU Yong-jian;ZHANG Wei;WANG Qian-qian(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035;Zhejiang HIKSTOE Technology Co.,LTD.,Hangzhou 310000)

机构地区：[1]中国电子科技集团公司第五十八研究所,无锡214035 [2]浙江驰拓科技有限公司,杭州310000

出　　处：《环境技术》2024年第1期74-79,共6页Environmental Technology

摘　　要：本研究提出了一种针对塑封基板类翻新件的无损鉴别方法。通过外观特征分析、声学扫描电子显微镜分析和X射线分析等技术方法,实现了塑封基板类翻新件的无损鉴别方法。结合相关案例,揭示了塑封基板类器件的典型翻新物理特征,有效指导了塑封基板类翻新器件的鉴别方向。针对典型翻新物理特征进行综合评价和风险分级,进一步加强了塑封基板类器件在应用过程中的风险规避。This study proposes a non-destructive identification method for refurbished parts of plastic packaging substrates.Through technical methods such as appearance feature analysis,X-ray analysis and acoustic scanning electron microscopy analysis,non-destructive identification of refurbished plastic packaging substrate components has been achieved.Combined with relevant cases,the typical refurbishment physical characteristics of plastic encapsulated substrate devices were revealed,effectively guiding the identification direction of plastic encapsulated substrate refurbished devices.Comprehensive evaluation and risk classification were conducted for typical refurbished physical features,further strengthening risk avoidance in the application process.

关 键 词：翻新件 无损鉴别 塑封基板 物理特征 

分 类 号：TN709[电子电信—电路与系统]