无镍型化学镀铜工艺研究  

Investigation on Nickel-Free Electroless Copper Plating Process

作　　者：詹安达 杨帆[1] 孙宇曦 曾庆明 Zhan Anda;Yang Fan;Sun Yuxi;Zeng Qingming

机构地区：[1]广东工业大学轻工化工学院,广东广州510006 [2]广东硕成科技股份有限公司,广东韶关512700

出　　处：《印制电路资讯》2024年第1期98-103,共6页Printed Circuit Board Information

摘　　要：为了追求环保和可持续发展的目标,无镍化学镀铜被广泛视为未来的趋势。这种镀铜方法显著降低了传统工艺所带来的负面环境影响,它不仅消除了对镍盐的依赖,还将废水和废料的产生降至最低。本文的研究集中在开发一种无镍型化学镀铜镀液,通过对镀液的成分和工艺条件进行深入研究,成功实现了一种具有高沉积速率和稳定性良好的无镍型化学镀铜镀液。研究结果表明,这一创新的无镍电镀系统具有广阔的可持续和环保镀铜应用前景。In pursuit of environmentally friendly and sustainable practices,nickel-free chemical copper plating has gained prominence as a future trend.This method significantly reduces the adverse environmental impacts associated with traditional processes by eliminating the reliance on nickel salts and minimizing the generation of wastewater and waste materials.This paper is focused on the development of a nickel-free chemical copper plating solution with high deposition rates and exceptional stability through an investigation of the composition and process conditions of the plating bath.The results demonstrate the feasibility of this novel nickel-free electroplating system,offering promising prospects for sustainable and eco-friendly copper plating in the future.

关 键 词：化学镀铜 无镍 稳定性 高沉积速率 

分 类 号：TQ1[化学工程]