某型电子设备机箱散热结构设计及试验测试  

Heat dissipation structure design and experimental tests of an electronic equipment chassis

作　　者：姜慧枫 张萌[1] 颜倩 JIANG Huifeng;ZHANG Meng;YAN Qian(School of Mechanical and Electronic Information,China University of Geosciences(Wuhan),Wuhan 430074)

机构地区：[1]中国地质大学(武汉)机械与电子信息学院,湖北武汉430074

出　　处：《机械设计》2024年第1期218-224,共7页Journal of Machine Design

基　　金：国家自然科学基金(51705483);中国地质大学(武汉)实验室开放基金(SKJ2022126)。

摘　　要：针对某型医用电子设备要兼顾内部散热及外形美观紧凑的要求,采用热仿真软件Flotherm对该医用电子设备的温度场进行了仿真。根据仿真结果,提出增加GPU散热背板、箱体上层开通风孔、箱体下层增加通风格栅及增加风扇等改进措施,通过综合分析与对比,得到适用于该设备的最佳散热方案。根据散热方案对机箱进行结构改进设计,呈现箱体散热结构与外形的协调美。通过对实际样机进行热试验测试,对比样机实测温度数据与最终改进方案的热仿真结果,表明相同工况下医用电子设备内各主要发热器件的温差均处于可接受的差异范围内,验证了热设计的正确性。该设计增强了设备的运行稳定性与可靠性,也为同类型的医疗电子设备热设计提供了参考。Aiming at the requirements of internal heat dissipation and aesthetically pleasing and compact form of an electronic device,the thermal simulation software Flotherm was used to simulate the temperature field of a medical electronic device.Based on the simulation results,the improvements were proposed such as adding a GPU cooling backplane,setting ventilation holes in the upper part of the chassis,adding ventilation grilles in the lower part of the case and adding fans.An optimal cooling solution for the device was finally obtained through comprehensive analysis and comparison.The design of the chassis was improved according to the thermal solution,resulting in a harmonious design between thermal structure and appearance.The comparison results between measured temperature data and improved thermal simulation results showed that the temperature difference between the main heat generating devices in the medical electronic equipment was within an acceptable range through thermal experiments on the actual prototype under the same operating conditions,which verified the correctness of the thermal design.The design enhanced the operational stability and reliability of the device and provided references for thermal design of similar medical electronic devices.

关 键 词：热设计 结构设计 FLOTHERM 散热方案 热测试 

分 类 号：TN03[电子电信—物理电子学] TH122[机械工程—机械设计及理论]