微型电声器件贴装工艺及应用  

Mounting Technology and Application for Micro Electroacoustic Devices

作　　者：陈春年 CHEN Chunnian(Jiangsu Simand Electric Co.,Ltd.,Suzhou 215000,China)

机构地区：[1]江苏新安电器股份有限公司,江苏苏州215000

出　　处：《电子工艺技术》2024年第2期59-62,共4页Electronics Process Technology

摘　　要：由于微型电声器件制作的过程特殊性及工艺难点,对产品质量管控、SMT环境及装联工艺带来了挑战。为解决此问题,通过技术攻关、工艺研究,总结出了一套微型电声器件装联工艺,提升了产品质量,满足了客户要求。Due to the particularity of the process and technical difficulties in the manufacture of microelectroacoustic devices,it brings challenges to product quality control,SMT environment and assembly process.In order to solve this problem,through technical research and process research,a set of microelectroacoustic device assembly process is summarized,which improves product quality and meets customer requirements.

关 键 词：PCB 钢网 助焊剂 可靠性 

分 类 号：TN605[电子电信—电路与系统]