面向三维立体集成封装的微流道散热技术  

Micro-channel Cooling Technology for Three-dimensional Integration

作　　者：张志模 张爱兵 汤莲花 朱家昌 ZHANG Zhi-mo;ZHANG Ai-bin;TANG Lian-hua;ZHU Jia-chang(China Electronics Technology Group Corporation No.58 Research Institute)

机构地区：[1]中国电子科技集团公司第五十八研究所

出　　处：《中国集成电路》2024年第3期82-90,共9页China lntegrated Circuit

摘　　要：现代化三维立体集成技术的发展,对电子元器件提出了高密度、集成化和小型化的要求,其内部过高的热流密度成为影响器件长期可靠性的决定性因素。在这种发展趋势下,电子产品热管理的地位不断提升,其重要性甚至不下于芯片设计本身。自微流道散热技术诞生以来,其展现出的优异的散热效果,使其成为高密度集成器件热管理的首选方案,并受到世界范围内研究者广泛关注。经过数十年的研究,微流道技术演化出几种不同的技术路线,并出现了十数种不同结构的微流道设计方案。为了更好地理解这种日新月异的技术,本文进行了系统性的调研和综述。With the development of modern three-dimensional integration technology,electronic components with high density,integration and miniaturization are required,and the high internal heat flux becomes a decisive factor affecting the long term reliability of devices.Under this development trend,the thermal management becomes more and more important,whose importance is no less than the chip design itself.Micro-channel cooling technology takes the advantage of excellent thermal dissipation,making it the first choice for thermal management for high-density integrated devices,and attaches worldwide attention.After decades of research,the micro-channel technology has evolved several different routes,and more than ten kinds of micro-channel design schemes with different structures has appeared.To get better understanding of this rapidly changing technology,systematic research and reviews are necessary.

关 键 词：三维集成 热管理 微流道 电子封装 

分 类 号：TN405[电子电信—微电子学与固体电子学] TK124[动力工程及工程热物理—工程热物理]