Sn95Sb5焊料与ENIG/ENEPIG镀层焊点界面可靠性研究  

Reliability Study of Solder Joint Interface Between Sn95Sb5 Solder and ENIG/ENEPIG Coatings

作　　者：徐达[1] 魏少伟 申飞 梁志敏[2] 马紫成 XU Da;WEI Shaowei;SHEN Fei;LIANG Zhimin;MA Zicheng(China Electronics Technology Group Corporation No.13 Research Institute,Shijiazhuang 050061,China;School of Material Science and Engineering,Hebei University of Science and Technology,Shijiazhuang 050018,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050061 [2]河北科技大学材料科学与工程学院,石家庄050018

出　　处：《电子与封装》2024年第3期29-33,共5页Electronics & Packaging

摘　　要：研究了Sn95Sb5焊料在化学镍金(ENIG)镀层、化学镍钯浸金(ENEPIG)镀层表面形成的焊点界面微观组织形貌与剪切强度。使用Sn95Sb5焊料在FR4印制板上焊接0805片式电容,焊点在高温时效测试和温度循环过程中均表现出较高的剪切强度,焊点界面连续且完整,剪切强度下降的最大幅度不超过19.2%。Sn95Sb5焊料在ENIG镀层表面形成的焊点(Sn95Sb5/ENIG焊点)强度更高。Sn95Sb5焊料在ENEPIG镀层表面形成的焊点(Sn95Sb5/ENEPIG焊点)界面反应更为复杂,在焊点界面附近可观察到条块状的(Pd,Ni,Au) Sn4。Sn95Sb5/ENEPIG焊点界面的金属间化合物层平均厚度约为Sn95Sb5/ENIG焊点界面的2倍。The microstructural morphology and shear strength of the solder joint interface formed by Sn95Sb5 solder on the surfaces of electroless nickel-gold(ENIG)coatings and electroless nickel-palladium immersion gold(ENEPIG)coatings are investigated.Using Sn95Sb5 solder to solder 0805 chip capacitors on FR4 printed circuit boards,the solder joints show high shear strength in both high temperature aging tests and temperature cycling,the solder joint interface is continuous and intact,and the maximum decrease in shear strength degradation does not exceed 19.2%.The solder joints formed by Sn95Sb5 solder on the surface of the ENIG coating(Sn95Sb5/ENIG solder joints)have higher strength.The interfacial reaction of Sn95Sb5 solder on the surface of ENEPIG coating(Sn95Sb5/ENEPIG solder joints)is more complex,and strip-like(Pd,Ni,Au)Sn4 can be observed near the solder interface.The average thickness of the intermetallic compound layer at the Sn95Sb5/ENEPIG solder joint interface is about twice that at the Sn95Sb5/ENIG solder joint interface.

关 键 词：Sn95Sb5焊料 化学镍金镀层 化学镍钯浸金镀层 回流焊 封装技术 

分 类 号：TN305.94[电子电信—物理电子学]