X射线光电子能谱技术在无铅焊料中的应用  

Application of X-ray photoelectron spectroscopy in lead-free solders

作　　者：宋世杰 张磊 唐梦奇 乐韵琳 杨文超 SONG Shijie;ZHANG Lei;TANG Mengqi;LE Yunlin;YANG Wenchao(State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures,MOE Key Laboratory of New Processing Technology for Nonferrous Metals and Materials,School of Resources,Environment and Materials,Guangxi University,Nanning 530004,China;Nanning Customs Technology Centre,Nanning 530000,China)

机构地区：[1]省部共建特色金属材料与组合结构全寿命安全国家重点实验室,有色金属及材料加工新技术教育部重点实验室,广西大学资源环境与材料学院,广西南宁530004 [2]南宁海关技术中心,广西南宁530000

出　　处：《冶金分析》2024年第2期1-9,共9页Metallurgical Analysis

基　　金：广西高等教育本科教学改革工程项目(2022JGB107);广西自然科学基金(2020GXNSFBA297062)。

摘　　要：先进的表面表征技术在无铅焊料的研究中发挥着至关重要的作用。作为一种具有高分辨率、高灵敏度的表面分析方法,X射线光电子能谱(X-ray photoelectron spectroscopy,XPS)可以对元素种类及化学价态等信息进行精准分析。文章主要介绍了XPS在无铅焊料的组分及其氧化、润湿、腐蚀、电迁移等性能方面的应用,并多角度阐述了无铅焊料及焊点性能的影响机理,致力于为日后XPS在无铅焊料中的研究工作提供一些帮助。Advanced surface characterization techniques play a crucial role in the investigation of lead-free solders.As a surface analysis method with high resolution and sensitivity,X-ray photoelectron spectroscopy(XPS)can accurately analyze the element type and valence states.In this paper,the application of XPS in analysis of chemical composition,oxidation,wetting,corrosion,electromigration and other properties of lead-free solders was mainly introduced.The influencing mechanisms of lead-free solders and solder joint properties were comprehensively discussed from multiple perspectives,which could provide some references for the studies of lead-free solders by XPS in future.

关 键 词：无铅焊料 X射线光电子能谱(XPS) 氧化机理 润湿机理 腐蚀机理 电迁移 

分 类 号：O657.62[理学—分析化学] TG42[理学—化学]