热致液晶高分子膜的表面处理及化学镀铜  

Surface Modification and Electroless Copper Plating of Thermotropic Liquid Crystal Polymer Film

作　　者：刘述梅[1] 陈红 赵建青[1] 肖中鹏 LIU Shumei;CHEN Hong;ZHAO Jianqing;XIAO Zhongpeng(College of Materials Science and Engineering,South China University of Technology,Guangzhou 510640,China;Kingfa Science&Technology Co.,Ltd.,Guangzhou 510700,China)

机构地区：[1]华南理工大学材料科学与工程学院,广东广州510640 [2]金发科技股份有限公司,广东广州510700

出　　处：《塑料工业》2024年第2期60-65,140,共7页China Plastics Industry

基　　金：广东省重点领域研发计划“5G通信关键材料及应用”重点专项项目基金资助(2020B010179001)。

摘　　要：论文采用氢氧化钠(NaOH)溶液对Vecstar型热致液晶高分子(TLCP)膜表面进行刻蚀粗化,然后通过3-氨丙基三乙氧基硅烷(KH550)在膜表面引入氨基,利用氨基络合银离子使膜表面活化,再进行无钯化学镀铜,提升了TLCP膜与金属铜之间的黏附力。借助扫描电子显微镜(SEM)、接触角测量仪、X射线衍射仪(XRD)和剥离测试等对经表面处理及化学镀铜后的TLCP膜进行表征,探讨了NaOH溶液浓度、表面粗化温度和时间、活化溶液组成等对TLCP表面化学镀铜的影响。结果表明,经表面处理后TLCP膜表面产生均匀的孔洞,接触角下降至29.30°,亲水性大幅提高;所镀铜层呈光亮的粉色,带有金属光泽,致密平滑,纯度高,镀层厚度可达2.78μm,与TLCP膜间的附着力等级达到了5B。In this paper,thermotropic polyarylate liquid crystal polymer(TLCP)films were surface-etched and roughened using sodium hydroxide(NaOH)solution,then amino groups were introduced on the surface of the film by 3-aminopropyltriethoxysilane(KH550)to achieve surface activation by complexing silver ions with the amino groups,and then the films were palladium-free chemical copper plated,which improved the adhesion between the TLCP film and metallic copper.The TLCP films after surface treatment and chemical copper plating were characterized by scanning electron microscopy(SEM),contact angle measurement,X-ray diffractometer(XRD)and peel test.The effects of the concentration of NaOH solution,surface-roughing temperature and time and the composition of activation solution on electroless copper plating on TLCP films were discussed.The results show that the surface treatment produces uniform holes on the surface of the film,the contact angle decreases to 29.30°,and the hydrophilicity increases significantly.The plated copper layer is bright pink with metallic luster,dense and smooth,with high purity,and the thickness of the plated layer reaches 2.78μm,and the adhesion grade between the plated layer and the TLCP film reaches 5B.

关 键 词：聚芳酯液晶膜 粗化 活化 化学镀铜 

分 类 号：TQ314[化学工程—高聚物工业]