原子层制造的研究现状与科学挑战  

Current Status and Scientific Challenges of Atomic Layer Manufacturing

作　　者：钱林茂[1] 陈蓉[2] 朱利民[3] 赵德文 彭小强[5] 周平 邓辉 余家欣[8] 曹坤 杜春阳 武恩秀 江亮 石鹏飞 陈磊 Linmao Qian;Rong Chen;Limin Zhu;Dewen Zhao;Xiaoqiang Peng;Ping Zhou;Hui Deng;Jiaxin Yu;Kun Cao;Chunyang Du;Enxiu Wu;Liang Jiang;Pengfei Shi;Lei Chen(School of Mechanical Engineering,Southwest Jiaotong University,Chengdu 610031;School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074;School of Mechanical and Power Engineering,Shanghai Jiaotong University,Shanghai 200040;Department of Mechanical Engineering,Tsinghua University,Beijing 100084;School of Artificial Intelligence,National University of Defense Technology,Changsha 410073;School of Mechanical Engineering,Dalian University of Technology,Dalian 116081;Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen 518055;School of Manufacturing,Key Laboratory of Testing Technology for Manufacturing Process,Ministry of Education,Mianyang 621010;National Key Laboratory of Precision Testing Technology and Instruments,Tianjin University,Tianjin 300072)

机构地区：[1]西南交通大学机械工程学院,成都610031 [2]华中科技大学机械科学与工程学院,武汉430074 [3]上海交通大学机械与动力工程学院,上海200040 [4]清华大学机械工程系,北京100084 [5]国防科技大学人工智能学院,长沙410073 [6]大连理工大学机械工程学院,大连116081 [7]南方科技大学机械与能源工程系,深圳518055 [8]西南科技大学制造过程测试技术教育部重点实验室,绵阳621010 [9]天津大学精密测试技术及仪器全国重点实验室,天津300072

出　　处：《中国科学基金》2024年第1期99-114,共16页Bulletin of National Natural Science Foundation of China

基　　金：国家自然科学基金项目(52235004,51991373,52122507)的资助。

摘　　要：原子层制造是指加工精度达到原子层量级的可控制造技术,包括原子层去除、添加、迁移等。针对信息、能源、航空航天等领域核心零部件超高性能构建的发展需求,通过原子层可控去除制造全频段原子级精度无损表面,并结合原子层增材制造原子级新结构,有望实现特殊功能的有效创成,保证超高性能的安全可靠。另外,后摩尔时代先进芯片的制造工艺将迈入亚纳米物理极限,原子层制造需求贯穿芯片制造工艺的全流程。本文阐述了原子层制造技术的发展需求与研究进展,围绕原子层抛光、原子层沉积/刻蚀、原子层损伤控制、原子层工艺与装备等领域,梳理了原子层制造的发展方向及研究目标,凝练了原子层制造领域未来的关键科学问题及面临的挑战,探讨了前沿研究方向和发展战略。Atomic layer manufacturing(ALM)is a controllable technology with a processing accuracy at atomic layer level,which involves atomic layer removal,atomic layer addition,atomic layer migration,and other processes.In response to the development needs of ultra-high performance construction in the fields such as information,energy and areospace,it is necessary to produce atomic accuracy non-destructive surface in the whole frequency domain through atomic layer controllable removal.It is expected to achieve effective creation of special functions and ensure the safety and reliability of ultra-high performance applications combining with the creation of new atomic level structures.Furthermore,the manufacturing process of advanced chips in the post-Moore era will face the sub-nanometer physical limit,almost all chip manufacturing processes need ALM technology.One the one hand,the surfaces of chip substrate and interconnection structure must be polished to be with atomic level global flatness and surface accuracy.On the other hand,it must develop atomic layer additive manufacturing to fabricate the feature sizes as small as one or several atomic layer thicknesses,finally matching nanoscale linewidth chip manufacturing.This paper reviews the development needs and research progress of ALM technology,focusing on the fields of atomic layer polishing,deposition/etching,damage control,technology,and equipment,and summarizes the development direction and research objectives of ALM,as well as the key scientific issues and challenges faced in the future of ALM.

关 键 词：原子层制造 原子层抛光 原子层沉积/刻蚀 原子层损伤控制 原子层制造工艺与装备 

分 类 号：O562[理学—原子与分子物理]