环保型缓蚀剂壳寡糖对304不锈钢化学机械抛光的影响  

Effect of Environmentally Friendly Corrosion InhibitorChito-oligosaccharide on CMP of 304 Stainless Steel

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作  者:张鑫 陈国美 倪自丰 季明捷 郑世坤 卞达 钱善华 ZHANG Xin;CHEN Guomei;NI Zifeng;JI Mingjie;ZHENG Shikun;BIAN Da;QIAN Shanhua(School of Mechanical Engineering,Jiangnan University,Wuxi Jiangsu 214122,China;School of Mechanical and Electrical Engineering,Wuxi Vocational Institute of Commerce,Wuxi Jiangsu 214153,China;Jiangsu Province Engineering Research Center of Micro-Nano Additive and Subtractive Manufacturing,Wuxi Jiangsu 214122,China)

机构地区:[1]江南大学机械工程学院,江苏无锡214122 [2]无锡商业职业技术学院机电技术学院,江苏无锡214153 [3]江苏省微纳增减材制造工程研究中心,江苏无锡214122

出  处:《润滑与密封》2024年第3期97-104,共8页Lubrication Engineering

基  金:国家自然科学基金项目(52205196);江苏省高等学校自然科学研究面上项目(19KJB460023)。

摘  要:为研究环保型缓蚀剂壳寡糖对304不锈钢化学机械抛光过程和抛光效果的影响,探讨其在抛光过程中与金属表面的作用方式及吸附机制,采用化学机械抛光试验、接触角测量、扫描电子显微镜(SEM)和X-射线色散能谱仪(EDS)分析等方法,研究壳寡糖有机分子对304不锈钢化学机械抛光的影响,采用量子化学计算研究壳寡糖分子的全局反应参数,分析计算反应活性位点,采用分子动力学模拟有机分子在金属表面的吸附并分析活性原子的径向分布。结果表明:CMP抛光过程中添加壳寡糖能够通过吸附作用在304不锈钢表面形成一层疏水性的薄膜,抑制氧化剂对不锈钢表面的刻蚀,提高抛光后的表面质量;在壳寡糖质量浓度为400 mg/L时得到表面粗糙度为1.65 nm的最佳表面质量。量子化学研究表明,壳寡糖的活性反应位点主要为O原子,能够在金属表面形成多中心吸附。分子动力学模拟表明,壳寡糖有机分子能够平行吸附在金属表面,有机分子中的O原子能够与铁原子形成配位键,在吸附中占据主导地位。In order to study the effect of environmentally friendly additive chito-oligosaccharide(COS)on the chemical mechanical polishing process of 304 stainless steel,and to explore its interaction and adsorption mechanism with metal surface during the polishing process,the influence of COS organic molecules on chemical mechanical polishing of 304 stainless steel was studied using methods such as chemical mechanical polishing experiments,contact angle measurements,scanning electron microscopy(SEM)and energy dispersive spectrometer(EDS)analysis.The global reaction parameters of COS molecules were studied by quantum chemical calculation,the reaction active sites were analyzed and calculated,the adsorption of organic molecules on metal surface was simulated by molecular dynamics,and the radial distribution of active atoms was analyzed.The results show that the incorporation of COS in the chemical mechanical polishing(CMP)process leads to the formation of a hydrophobic film on the surface of 304 stainless steel via adsorption mechanisms.This film effectively hinders the etching action of oxidizing agents on the stainless steel surface,thereby enhancing the resulting surface quality after the polishing treatment.The best surface quality with surface roughness of 1.65 nm is obtained when the mass concentration of COS is 400 mg/L.Quantum chemistry studies show that the active reaction sites of COS are mainly O atoms,which can form multicentric adsorption on metal surfaces.Molecular dynamics simulations show that COS organic molecules can be adsorbed on metal surfaces in parallel,and O atoms in organic molecules can form coordination bonds with iron atoms,which dominates adsorption.

关 键 词:壳寡糖 化学机械抛光 吸附机制 量子化学研究 分子动力学模拟 

分 类 号:TH117[机械工程—机械设计及理论] TG176[金属学及工艺—金属表面处理]

 

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