基于S形速度曲线的键合头运动控制系统研究与分析  

Research and Analysis of Bonding Head Motion Control Based on S-shaped Speed Curve

作　　者：高岳[1] GAO Yue(The 45^(th) Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2024年第2期52-57,共6页Equipment for Electronic Products Manufacturing

摘　　要：根据用户工艺需求,针对全自动芯片键合设备的运动控制模块以及键合头子模块开展需求分析,结合典型试验,设计出基于S形速度曲线的键合头运动控制系统,根据S形速度曲线重新规划了键合头的运动轨迹,使其对芯片键合周期缩短的同时也保证了键合精度。According to process requirement of users,the working principle of motion control module and the sub-module of bonding head of full-automatic chip bonding equipment are analyzed,the motion control system based on S-shaped velocity curve is designed,and the motion path of bonding head is redesigned according to the s-shaped velocity curve,and shortening the chip bonding cycle while ensuring its bonding accuracy.

关 键 词：运动控制模块 键合头 S形速度曲线 

分 类 号：TN305[电子电信—物理电子学]