低温度敏感度谐振式压力传感器设计与仿真  

Design and Simulation of a Low-Temperature Sensitive Resonant Pressure Sensor

作　　者：李光贤 黄晶 袁宇鹏 杨靖 李春洋[1,2] 张祖伟 龙帅 LI Guangxian;HUANG Jing;YUAN Yupeng;YANG Jing;LI Chunyang;ZHANG Zuwei;LONG Shuai(CETC Academy of Chips Technology,Chongqing 401332,China;NIICAS(Chongqing)Technology Co.,Ltd,Chongqing 401332,China;The 26th Institute of China Electronics Technology Group Corporation,Chongqing 400060,China)

机构地区：[1]中电科芯片技术(集团)有限公司,重庆401332 [2]国知创芯(重庆)科技有限公司,重庆401332 [3]中国电子科技集团公司第二十六研究所,重庆400060

出　　处：《压电与声光》2024年第2期202-206,共5页Piezoelectrics & Acoustooptics

基　　金：国家重点研发计划项目“飞机PHM系统用传感器生产及批量测试平台”(2022YFB3206504)。

摘　　要：为降低材料杨氏模量温度漂移和热应力对谐振式压力传感器温度漂移的影响,该文设计了一种基于Si-SiO 2复合H形谐振梁和双谐振器结构的低温度敏感度谐振压力传感器。通过有限元仿真软件COMSOL对传感器进行仿真验证。结果表明,在0~350 kPa内传感器灵敏度可达21.146 Hz/kPa,-50~125℃内零点温度漂移低至0.2 Hz/℃。与全硅结构相比,灵敏度温度漂移由339×10^(-6)/℃降低至14.1×10^(-6)/℃,可适应工作温度范围较高的环境。To reduce the influence of the change in Young’s modulus with changes in temperature and thermal stress on the temperature drift of a resonant pressure sensor,a low-temperature-sensitivity resonant pressure sensor based on a Si-SiO 2 composite H-shaped resonant beam and double resonator structure was designed.The finite element simulation software COMSOL was used to simulate the sensor,and the results showed that the sensitivity of the sensor could reach 21.146 Hz/kPa in the range of 0-350 kPa,and the zero temperature drift in the range of-50℃to+125℃was as low as 0.2 Hz/℃.Compared with anall-silicon structure,the sensitivity temperature drift was reduced from 339×10^(-6)/℃to 14.1×10^(-6)/℃,which could be adapted to anenvironment with a high operating temperature range.

关 键 词：谐振式压力传感器 温度漂移 温度灵敏度漂移 温度补偿 

分 类 号：TN389[电子电信—物理电子学] TP212[自动化与计算机技术—检测技术与自动化装置]