半导体制造工艺课程教学内容动态调整的研究  

Dynamic Adjustment of Semiconductor Manufacturing Process Courses

作　　者：张旭辉 施天宇 廖美成 Zhang Xuhui;Shi Tianyu;Liao Meicheng(Sino-Geeman College of Intelligent Manufacturing,Shenzhen Technology University,Shenzhen,518118,China)

机构地区：[1]深圳技术大学中德智能制造学院,广东深圳518118

出　　处：《中国现代教育装备》2024年第7期150-153,共4页China Modern Educational Equipment

基　　金：深圳技术大学2021年教学改革项目“新工科背景下半导体制造工艺课程的教学动态调整研究”(编号:20211001)。

摘　　要：目前半导体产业快速发展,电子专业相关课程中关于新技术和新工艺的内容仍未跟上发展速度,存在教材内容更新不及时、产学研结合不紧密等问题。对半导体制造工艺课程教学现状进行分析,结合存在的问题对教学内容进行改革,提出了教学内容动态更新机制,主动调研新技术趋势,根据行业发展并结合实际问题进行教学内容更新,注重培养学生的思考与分析能力。同时,采用产学研紧密结合与多种手段辅助教学的方式,提高学生对新内容的理解程度,最终实现教学内容动态更新的目标。At present,the semiconductor industry is developing rapidly,and the content of new technologies and new processes in the relevant courses of electronics majors has not kept up with the development speed,and there are problems such as the update of teaching materials is not timely,and the combination of industry,university and research is not close.This paper analyzes the current teaching situation of semiconductor manufacturing process course,reforms the teaching content in combination with existing problems,proposes a dynamic updating mechanism of teaching content,takes the initiative to investigate the trend of new technology,updates the teaching content according to the development of the industry and combines with practical problems,and focuses on cultivating students'thinking and analysis ability.At the same time,the close combination of production,learning and research with a variety of means to assist teaching methods to improve students'understanding of the new content,and finally achieve the goal of dynamic updating of teaching content.

关 键 词：半导体制造工艺 产学研结合 动态调整 

分 类 号：G642[文化科学—高等教育学]