基于系统级封装的RISC-V电路设计与实现  

Design and implementation of RISC-V circuit based on system-in-package

作　　者：刘旸 Liu Yang(Shencun Technology Ltd.,Wuxi 214000,China)

机构地区：[1]深存科技有限公司,江苏无锡214000

出　　处：《电子技术应用》2024年第4期44-47,共4页Application of Electronic Technique

摘　　要：为满足电子系统在性能、功耗、体积、重量和国产化等方面的需求,设计了一款基于系统级封装技术的RISC-V电路。该电路以采用自主指令集架构和国内工艺的处理器为核心,并集成了国产外围电路,实现了一款完全自主创新的、具备常用控制与通信接口的微系统电路。经过测试与验证,该电路各项功能和性能均达到设计指标,有效地提高了功能密度,很好地满足了电子系统在小型化、轻量化和低功耗等方面的需求。In order to meet the requirements of performance,power consumption,volume,weight and localization in electronic systems,one RISC-V circuit based on system-in-package technology is designed.The circuit is based on a processor that adopts an independent instruction set architecture and domestic process,and integrates domestic peripheral circuit to realize a completely independent and controllable microsystem circuit with common control and communication interfaces.After testing and verification,all functions and performance of the circuit have reached the design indicators,effectively improved the functional density,and satisfied the requirements of miniaturization,light weight and low power consumption for electronic systems.

关 键 词：系统级封装 微系统 RISC-V 

分 类 号：TN7[电子电信—电路与系统]