吡啶基咪唑衍生物合成及其在有机可焊保护剂中的应用  

Synthesis of a pyridyl-containing imidazole derivative and its application in organic solderabilitypreservative

作　　者：杨泽 张桂敏 雷家珩 何康 马斯才 YANG Ze;ZHANG Guimin;LEI Jiaheng;HE Kang;MA Sicai(School of Chemistry,Chemical Engineering and Life Sciences,Wuhan University of Technology,Wuhan 430070,China;Shenzhen Beijia Electronic Materials Co.,Ltd.,Shenzhen 518102,China)

机构地区：[1]武汉理工大学化学化工与生命科学学院,湖北武汉430070 [2]深圳市贝加电子材料有限公司,广东深圳518102

出　　处：《电镀与涂饰》2024年第4期56-64,共9页Electroplating & Finishing

摘　　要：[目的]咪唑及其衍生物的水溶性较差,制备的有机可焊保护剂(OSP)不稳定,易出现浑浊或析出固体物质。[方法]以3,5-二氯吡啶-4-甲醛与1-苯基-1,2-丙二酮为原料,合成了2-(2,6-二氯-4-吡啶基)-4-苯基-5-甲基咪唑(DPN),将其用作OSP的主成膜物。使用气相色谱-质谱联用仪(GC-MS)、核磁共振仪(NMR)、傅里叶变换红外光谱仪(FT-IR)表征其结构。通过浸泡腐蚀、电化学分析、热重分析、回流焊测试、边缘浸焊测试等手段对DPN成膜之后的耐蚀性、耐热性和焊接性进行了研究。[结果]制备的DPN水溶性良好,对提高OSP的稳定性有利。DPN在铜表面的有效吸附和成膜能够很好地保护铜面不被腐蚀,赋予铜面优良的耐热性和可焊性。[结论]DPN可用作印制电路板有机可焊保护剂的主成膜物。[Introduction]The water solubility of imidazole and its derivatives is poor,and the organic solderability preservative(OSP)solutions prepared from them is unstable,as shown by easy occurrence of turbidity or precipitation of insolubles.[Method]A pyridyl-containing imidazole derivative named 2-(2,6-dichloro-4-pyridyl)-4-phenyl-5-methylimidazole(DPN)was synthesized from 3,5-dichloropyridin-4-formaldehyde and 1-phenyl-1,2-malondialone,and then used as the main film-forming agent for OSP.The structure of DPN was characterized by gas chromatography-mass spectrometry(GC-MS),nuclear magnetic resonance spectroscopy(NMR),and Fourier-transform infrared spectroscopy(FT-IR).The corrosion resistance,thermal resistance,and weldability of the DPN-based OSP film were examined by immersion corrosion test,electrochemical analysis,thermogravimetry,reflow soldering test,and edge dip test.[Result]The synthesized DPN had good water solubility,which is beneficial to improve the stability of OSP.The effective adsorption and film formation of DPN on the copper surface not only can protect the copper from corrosion effectively,but also enable the copper excellent thermal resistance and weldability.[Conclusion]DPN can be used as the main film-forming agent of OSP in manufacturing of printed circuit boards.

关 键 词：吡啶基咪唑衍生物 有机可焊保护剂 印制电路板 耐蚀性 耐热性 可焊性 

分 类 号：TG178[金属学及工艺—金属表面处理]