Flip Chip技术在集成电路封装中的应用  

Application of Flip Chip Technology in Integrated Circuit Packaging

作　　者：黄家友 HUANG Jiayou(Guizhou Zhenhua Fengguang Semiconductor Co.,Ltd.,Guizhou 550018,China)

机构地区：[1]贵州振华风光半导体股份有限公司,贵州550018

出　　处：《集成电路应用》2024年第3期56-57,共2页Application of IC

摘　　要：阐述从集成电路封装发展现状、Flip Chip技术内涵、Flip Chip技术在集成电路封装中的应用剖析、市场发展展望等多个角度,探讨在集成电路封装中,应用Flip Chip技术的必要性和重要性。This paper describes the necessity and importance of applying FlipChip technology in integrated circuit packaging from multiple perspectives,including the current development status of integrated circuit packaging,the connotation of FlipChip technology,the application analysis of Flip Chip technology in integrated circuit packaging,and market development prospects.

关 键 词：集成电路 Flip Chip技术 电子器件封装 

分 类 号：TN405[电子电信—微电子学与固体电子学]