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作 者:王津丰[1] 张平川[1] 任浩 聂勇 WANG Jin-feng;ZHANG Ping-chuan;REN Hao;NIE Yong(Southwest Institute of Applied Magnetics,Mianyang 621000,China)
出 处:《磁性材料及器件》2024年第2期73-77,共5页Journal of Magnetic Materials and Devices
摘 要:提出了一种YIG调谐滤波器专用、基于低温共烧陶瓷(LTCC)工艺的小型化驱动器,其采用系统化封装SIP方案,体积缩小至常规小型化驱动器的1/4,以LTCC工艺技术制作的陶瓷基板为主载板、氮化铝基板为大功率元件载板,通过高密度SIP集成电容、电阻、集成电路裸芯的方式,实现驱动器的小型化。通过对基板特性分析、热源的计算与仿真、电流温度补偿,有效解决了小型化驱动器的电流温度漂移,使其电流温度漂移小于±0.5 mA,驱动器对YIG调谐器件(滤波器调谐灵敏度为20 MHz/mA)的频率温度漂移影响值小于±10 MHz,满足了YIG调谐器件的小型化驱动需求。A YIG filter-specific miniaturized driver based on low-temperature co-fired ceramic(LTCC)process is proposed to reduce the volume to 1/4 of the conventional miniaturized driver,which adopts a systematic encapsulated SIP scheme.The ceramic substrate made by LTCC process technology is the main carrier board,and the aluminum nitride substrate is the carrier board for high-power components,which realizes the miniaturization of the driver by high-density SIP integrated capacitor,resistor,and integrated circuit core.Through the analysis of substrate characteristics,calculation and simulation of heat source,and current temperature compensation,this paper effectively solves the current temperature drift of the miniaturized driver,so that the current temperature drift is less than±0.5 mA,and the influence value of the frequency and temperature drift of the driver on the YIG-tuned device(filter tuning sensitivity is 20 MHz/mA)is less than±10 MHz,which meets the miniaturization drive requirements of YIG-tuned devices.
关 键 词:YIG调谐滤波器 低温共烧陶瓷 SIP集成 驱动器
分 类 号:TN713[电子电信—电路与系统]
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