磷系阻燃环氧电子封装材料研究进展  

Research Progress of Phosphorus-based Flame Retardant Epoxy Electronic Packaging Materials

作　　者：于光 YU Guang(School of Communication,Shenzhen Polytechnic University,Shenzhen 518055,China)

机构地区：[1]深圳职业技术大学传播工程学院,深圳518055

出　　处：《高分子通报》2024年第5期630-639,共10页Polymer Bulletin

基　　金：广东省普通高校青年创新人才类项目(项目号2021WQNCX229)。

摘　　要：磷系阻燃环氧树脂具有阻燃效率高、制备成本低、环境危害小等显著优点,成为5G通讯、智能电子和半导体等领域的重要封装材料。基于高效磷系阻燃环氧封装材料的性能要求,介绍了磷系阻燃环氧树脂的种类和阻燃机理,总结了当前磷系阻燃环氧树脂在电子封装领域的应用研究进展并对其未来发展趋势进行了展望,指出本征型(反应型)磷系阻燃环氧树脂存在制备困难、有效磷含量低等问题,需要进一步优化工艺并提升封装体系中的磷含量。相比之下,填充型磷系阻燃环氧树脂的制备工艺简单、阻燃剂种类多、磷含量较高,在电子封装领域应用最为广泛。Phosphorus-based flame retardant epoxy is an important packaging material for 5G communications,smart electronics and semiconductors due to its advantages of high flame retardant efficiency,low preparation cost and small environmental hazards.Based on the performance requirements of high efficiency phosphorus-based flame-retardant epoxy packaging materials,the types and flameretardant mechanism of phosphorus-based flame-retardant epoxy were introduced,the application of phosphorus-based flame retardant epoxy in electronic packaging was reviewed,and the future development trend was prospected.It was pointed out that the preparation of intrinsic(reactive)phosphorus-based flame retardant epoxy was difficult and the content of available phosphorus was low,so it was necessary to further optimize the process and increase the phosphorus content in the packaging system.In contrast,the filled phosphorus-based flame retardant epoxy was the most widely used in electronic packaging due to its simple preparation process,various flame retardants and high phosphorus content.

关 键 词：磷系阻燃 阻燃效率 环氧树脂 电子封装 阻燃机理 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业] TN05[电子电信—物理电子学]