面向高深宽比微细嵌入式金属网格结构的选择性镀铜工艺  

Selective Copper Plating Process for High Aspect Ratio Micro Scale Embedded Metal Mesh Structures

作　　者：胡睿 潘艳桥 杨翊 王宝丽 Hu Rui;Pan Yanqiao;Yang Yi;Wang Baoli(Hubei Provincial Key Laboratory of Mechanical Transmission and Manufacturing Engineering,School of Mechanical Automation,Wuhan University of Science and Technology,Wuhan 430081,China;Precision Manufacturing Research Institute,School of Mechanical Automation,Wuhan University of Science and Technology,Wuhan 430081,China;Key Laboratory of Metallurgical Equipment and Control of Ministry of Education,School of Mechanical Automation,Wuhan University of Science and Technology,Wuhan 430081,China;State Key Laboratory of Intelligent Manufacturing Equipment and Technology,School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]武汉科技大学机械自动化学院机械传动与制造工程湖北省重点实验室,武汉430081 [2]武汉科技大学机械自动化学院精密制造研究院,武汉430081 [3]武汉科技大学机械自动化学院冶金装备及其控制教育部重点实验室,武汉430081 [4]华中科技大学机械科学与工程学院智能制造装备与技术全国重点实验室,武汉430074

出　　处：《微纳电子技术》2024年第5期149-156,共8页Micronanoelectronic Technology

基　　金：国家自然科学基金(11932009,52175536);智能制造装备与技术全国重点实验室开放课题基金(IMETKF2023010)。

摘　　要：高深宽比微细嵌入式金属网格结构具有出色的光电性能和机械稳定性,可广泛应用于柔性触摸/显示器、太阳能电池、智能窗户等领域,但是传统的制备方法存在难以形成高深宽比结构、分辨率不足或材料利用率低等问题。借助电流体喷墨打印高分辨率按需喷印的优势结合选择性镀铜的特点实现高深宽比微细嵌入式金属网格的制备。通过实验研究,揭示了镀液温度、铜离子质量浓度、电流密度、电镀时间等参数对铜生长的速率和截面质量的影响规律,并对比了电镀和化学镀的优劣。结果表明,在电流密度约为1.5 A/dm^(2)时,电镀铜15 min能够实现线宽为10μm、深宽比为1的微细凹槽结构内金属铜的完全填充。最后,通过优化后的镀铜工艺参数结合电流体喷印,制备了线宽为10μm、深宽比为1、周期为800μm的28 mm×60 mm的嵌入式金属网格,其透过率(可见光波段550 nm处)为87.3%,方阻约为0.26Ω/□,品质因数(FOM)达到10 318,达到行业较高水准,可为高性能柔性光电子器件的制备提供新途径。High aspect ratio micro scale embedded metal mesh structures have excellent photoelectric properties and mechanical stability and can be widely used in flexible touch/displays,solar cells,smart windows and other fields.However,traditional preparation methods have problems such as difficulty in forming high aspect ratio structures,insufficient resolution,or low material utilization.The advantages of electrohydrodynamic inkjet printing with high resolution and on demand printing combined with the characteristics of selective copper plating were used to fabricate micro scale embedded metal mesh with high aspect ratio.The influence laws of bath temperature,copper ion mass concentration,current density,electroplating time and other parameters on the growth rate and cross-sectional quality of copper were revealed through experiment studies,and the advantages and disadvantages of electroplating and chemical plating were compared.The results show that electroplating copper for 15 min can achieve complete filling of metal copper in the microgroove structure with a linewidth of 10μm and an aspect ratio of 1 at a current density of about 1.5 A/dm^(2).Finally,an 28 mm×60 mm embedded metal mesh with a linewidth of 10μm,an aspect ratio of 1 and a period of 800μm was fabricated by combining the optimized copper plating process parameters with electrohydrodynamic printing.The fabricated mesh has a transmittance of 87.3%(at 550 nm in the visible light band),a square resistance of about 0.26Ω/□ and a figure of merit(FOM)of 10318,reaching the higher standard of the industry.This provides a new approach for the fabrication of highperformance flexible optoelectronic devices.

关 键 词：嵌入式金属网格 电流体喷墨打印 选择性镀铜 透过率 高深宽比 

分 类 号：TH164[机械工程—机械制造及自动化] TQ153[化学工程—电化学工业]