热压作用下菌丝体粘接杨木单板的机理研究  

Exploring the Mechanism Behind Mycelium-bonded Poplar Veneers under Hot Pressing

作　　者：程泳彬 胡畔 王望 CHENG Yong-bin;HU Pan;WANG Wang(MOE Key Laboratory of Wooden Material Science and Application,Beijing Forestry University,Beijing 100083,P.R.China)

机构地区：[1]北京林业大学木质材料科学与应用教育部重点实验室,北京100083

出　　处：《林产工业》2024年第5期12-18,共7页China Forest Products Industry

基　　金：2022年北京市大学生创新创业训练计划项目(NO.X202210022151);“科技助力经济2020”重点专项“速生材制备功能型木质复合材料技术及应用”。

摘　　要：菌丝体复合材料在成型过程中,菌丝体作为粘合剂发挥着至关重要的作用。基质表面与菌丝体形成特殊的胶合界面,热压可改善界面的结合性能,对于复合材料的力学性能具有重要影响。以杨木单板为研究对象,采用云芝栓孔菌(Trametes versicolor)、木蹄层孔菌(Fomes fomentarius)和血红密孔菌(Pycnoporus sanguineus)3种白腐菌对其定殖14 d,在热压作用下构建菌丝体/木材胶合界面,并通过单搭接拉伸剪切试验评估杨木单板/菌丝体的界面胶合强度。结果表明:菌丝体/杨木单板胶合界面的形成过程中,白腐菌腐朽引起单板表面性质的变化,热压促进了界面层的反应。血红密孔菌菌丝体膜的胶合性能最优,在150℃,1.5 MPa的热压条件下,其胶合强度可达(1.34±0.11)MPa。菌丝体与木材之间的胶合界面通过机械互锁、氢键、席夫碱反应和木质素再聚合形成。研究结论可为菌丝体复合材料的性能调控提供参考。During the molding process of mycelium bio-composites,mycelium plays an important role as an adhesive.The surface of the substrate forms a special adhesion interface with the mycelium,and hot pressing can improve the interface bonding effect between mycelium and substrate,which has an important effect on the mechanical properties of the composite.In this article,the poplar veneer was taken as the raw material,and three white rot fungi,namely Trametes versicolor,Fomes fomentarius,and Pycnoporus sanguineus were used to colonize it for 14 days.Mycelium/wood bonding interface was formed under hot pressing,and the adhesion strength of the poplar veneer/mycelium interface was evaluated by a single-lap shear test.The results showed that during the formation process of the mycelium/poplar veneer bonding interface,white rot decay caused changes in the surface properties of the veneer,and hot pressing promoted the reaction of the adhesion interface.The mycelium film of Pycnoporus sanguineus gave rise to the best adhesion performance by hot pressing at 150℃and 1.5 MPa,with a lap-shear strength of(1.34±0.11)MPa.The bonding interface between mycelium and wood was formed by mechanical interlocking,hydrogen bonding,Schiff base reaction and the repolymerization of lignin.This work could provide reference for regulating the properties of mycelium bio-composites.

关 键 词：菌丝体膜 单板胶合 热压 搭接剪切强度 界面结合机理 

分 类 号：TS653[轻工技术与工程] TS396