高功率密度DC/DC电源模块结构设计与封装  

Structural Design and Packaging Technology of High Power Density DC/DC Power Supply Module

作　　者：史海林 张军 黄栋 李晶 任思雨 刘云凤 SHI Hailin;ZHANG Jun;HUANG Dong;LI Jing;REN Siyu;LIU Yunfeng(The 771st Research Institute of CASA,Xi’an 710119,China)

机构地区：[1]中国航天科技集团公司第九研究院第七七一研究所,西安710119

出　　处：《电子工艺技术》2024年第3期10-12,20,共4页Electronics Process Technology

摘　　要：高效率、高功率密度是DC/DC电源模块永恒的发展趋势。以一种封装尺寸为38.72 mm×22.80 mm×7.21 mm、输出功率为320 W的DC/DC模块电源为研制对象,从结构设计、热设计、封装工艺等方面进行了系统的研究。DC/DC电源模块采用“夹心”工艺结构,以高导热塑封工艺封装,工作温度范围为-55~125℃,可靠性满足航空航天领域高可靠要求。High efficiency and high power density are the eternal development trends of DC/DC power modules.A systematic study is conducted on a DC/DC power supply module with a packaging size of 38.72 mm×22.8 mm×7.21 mm and an output power of 320 W,including structural design,thermal design,packaging technology,etc.The DC/DC power module adopts a"sandwich"process structure,packaged with high thermal conductivity plastic sealing technology,with a working temperature range of-55~125℃,and its reliability meets the high reliability requirements of the aerospacefield.

关 键 词：高功率密度 DC/DC电源模块 结构设计 封装 

分 类 号：TN405[电子电信—微电子学与固体电子学]