晶圆键合设备中的加热盘设计  

Design of Heating Plate in Wafer Bonder

作　　者：段晋胜 王成君 李安华 DUAN Jinsheng;WANG Chengjun;LI Anhua(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2024年第3期35-36,58,共3页Electronics Process Technology

摘　　要：介绍了晶圆键合设备的加热盘,试验分析了该机构对晶圆键合质量的影响。结果表明,优化后的加热盘显著提升了晶圆键合的温度均匀性和稳定性,进而提升了键合质量和效率。研究增进了对加热盘设计在晶圆键合设备中应用效果的理解,为提高晶圆键合质量、推动技术创新提供了理论支撑和实践指导。The heating plate in wafer bonder is introduced,and the influence of this mechanism on wafer bonder quality is experimentally analyzed.The results show that the optimized heating plate significantly improves the temperature uniformity and stability of wafer bonding,thereby improving bonding quality and efficiency.The research has enhanced the understanding of the application effect of heating plate design in wafer bonder,providing theoretical support and practical guidance for improving wafer bonding quality and promoting technological innovation.

关 键 词：晶圆键合 加热盘 温度均匀性 键合质量 

分 类 号：TN402[电子电信—微电子学与固体电子学]