高功率半导体用纳米银焊膏的研究现状  

Research Status of Nano Silver Solder Paste for High-Power Semiconductors

作　　者：张宸赫 李盼桢 董浩楠 陈柏杉 黄哲[1] 唐思危 马运柱[1] 刘文胜[1] ZHANG Chenhe;LI Panzhen;DONG Haonan;CHEN Baishan;HUANG Zhe;TANG Siwei;MA Yunzhu;LIU Wensheng(National Key Laboratory of Science and Technology for High-Strength Structural Materials,Central South University,Changsha 410083,China)

机构地区：[1]中南大学轻质高强结构材料国家重点实验室,长沙410083

出　　处：《电子与封装》2024年第5期14-24,共11页Electronics & Packaging

基　　金：装备发展部领域基金预研项目(61409220415);湖南省自然科学基金(2019JJ50813)。

摘　　要：第3代半导体作为核心部件,使得更紧凑、高频率、高功率的电子器件在射频和微波电子、能源转换与储存、雷达和通信等领域展现出广泛的应用潜力。然而,高性能电子器件对其封装材料的导电性、导热性以及连接处的机械性能提出了更为严格的要求。纳米银焊膏因其卓越的低温烧结性能和在高温环境下的出色表现引起了广泛关注。然而,国内银粉和银焊膏产品的质量相对较低,且研发过程缺乏理论指导,必须依赖进口材料。基于高功率半导体用纳米银焊膏,综述了通过液相化学还原法合成纳米银粉的研究进展,以及纳米银焊膏的烧结机理、影响其性能的因素和控制方法,有望为国内纳米银焊膏的研发和生产提供有益的指导和支持。With third-generation semiconductors as core components,more compact,high-frequency,and high-power electronic devices have shown widespread application potential in fields such as radio frequency and microwave electronics,energy conversion and storage,radar and communications.However,high-performance electronic devices require stricter requirements for the electrical conductivity and thermal conductivity of their packaging materials,and mechanical properties of the joints.Nano silver paste has attracted widespread attention due to its excellent low-temperature sintering performance and excellent performance in high-temperature environments.However,the quality of domestic silver powder and silver paste products is relatively low,and the research and development process lack theoretical guidance and must rely on imported materials.Based on the nano silver paste used in high-power semiconductors,the synthesis of nano silver powder using liquid phase chemical reduction method is reviewed,the sintering mechanism of nano silver paste and the factors affecting its performance and controllable methods are studied,which are expected to provide useful guidance and support for the research and production of nano silver paste in China.

关 键 词：纳米银粉 纳米银焊膏 剪切强度 热导率 

分 类 号：TG425[金属学及工艺—焊接]