陶瓷球栅阵列封装元器件工艺装联适应性验证方法  

Verification Method for Assembly Process Adaptability of CBGA Components

作　　者：贺光辉[1] 吴俊明 曹振亚 李伟明[1] HE Guanghui;WU Junming;CAO Zhenya;LI Weiming(CEPREI,Guangzhou 511370,China;ZTE Corporation,Shenzhen 518057,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子质量》2024年第5期61-64,共4页Electronics Quality

摘　　要：针对陶瓷球栅阵列封装(CBGA)元器件,设计了一套完整的工艺装联适应性的验证流程与方法,并将该方法在一款CBGA器件中进行了应用。通过开展CBGA元器件工艺装联适应性验证,有效地识别了该款电子元器件在温度循环应力下存在的焊点开裂风险。该焊点开裂主要是由于元器件本体与印刷电路板(PCB)之间的热膨胀系数存在差异,在温度交替变化的环境中,焊点受到热机械疲劳应力作用从而发生开裂。该问题可以通过对CBGA器件进行点胶加固或采用柱栅阵列封装(CCGA)进行有效改善。A systemic verification process and method for assembly process adaptability of ceramic ball grid array packaging(CBGA)components is designed,and this method is applied to a CBGA component.By conducting the assembly process adaptability verification on the CBGA component,the risk of solder joint cracking under temperature cycling stress is effectively identified.The cracking of the solder joint is mainly due to the difference in thermal expansion coefficient between the component body and the PCB board.In the environment of alternating temperature change,solder joint crack due to thermal mechanical fatigue stress.This issue can be effectively improved by applying dispensing process on the CBGA component or using column grid array packaging(CCGA).

关 键 词：陶瓷球栅阵列封装 工艺装联适应性 热疲劳 

分 类 号：TN305.94[电子电信—物理电子学]