陶瓷封装外壳智能产线建设方案  

Ceramic Package Intelligent Production Line Construction Plan

作　　者：毕大鹏 李阳[1] 高岭[1] 刘林杰[1] BI Dapeng;LI Yang;GAO Ling;LIU Linjie(The 13th Research Institute of CETC,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子工业专用设备》2024年第3期37-43,共7页Equipment for Electronic Products Manufacturing

摘　　要：针对陶瓷封装外壳的大规模生产能力和质量一致性提升需求,依托多层陶瓷封装外壳生产工艺,研究了以工作站为基本单元进行生产线的全面布局设计与智能化升级的方案。详细阐述了智能产线的架构设计和关键技术,包括标准化模型、自动化工作站、自动化物流以及物联网和数据应用集成。最后,总结了智能生产线建设方案的重要价值在于其可复制性和推广性,它可以为行业的智能工厂建设提供参考,进而加快行业的数字化、网络化和智能化转型进程。Addressing the need for enhanced production capacity and consistent quality in ceramic package,this study examines a comprehensive layout design and intelligent upgrade scheme for a production line based on multilayer ceramic package process.The design encompasses standardized models,automated workstations,automated logistics,and the integration of Internet of Things(IoT)and data applications.The paper concludes that the value of this intelligent production line construction lies in its replicability and promotability,offering a reference for the development of intelligent factories within the industry and thereby expediting the digital,networked,and intelligent transformation of the sector.

关 键 词：智能制造 工作站 软件集成 陶瓷封装外壳 物联网 

分 类 号：TN605[电子电信—电路与系统]